Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NUDT1 | P36639 | 1/20 | 0.53 |
| ▸ | BACE1 | P56817 | 1/20 | 0.53 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.53 |
| ▸ | LCK | P06239 | 4/20 | 0.47 |
| ▸ | NQO2 | P16083 | 2/20 | 0.41 |
| ▸ | ALOX12 | P18054 | 2/20 | 0.40 |
| ▸ | THRB | P10828 | 2/20 | 0.40 |
| ▸ | ACMSD | Q8TDX5 | 2/20 | 0.40 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.40 |
| ▸ | RGS12 | O14924 | 1/20 | 0.40 |
| ▸ | TP53 | P04637 | 1/20 | 0.40 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.40 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.40 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.40 |
| ▸ | PKM | P14618 | 1/20 | 0.40 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.40 |
| ▸ | CASP1 | P29466 | 1/20 | 0.40 |
| ▸ | THPO | P40225 | 1/20 | 0.40 |
| ▸ | GNAI1 | P63096 | 1/20 | 0.40 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1823144 | 1.00 | NUDT1 (0.53) | NUDT1BACE1HSP90AA1LCKNQO2 | |
| SCHEMBL28475060 | 0.86 | HSP90AA1 (0.54) | NUDT1BACE1HSP90AA1THRBACMSD | |
| SCHEMBL28560654 | 0.86 | NUDT1 (0.50) | NUDT1BACE1HSP90AA1THRBACMSD | |
| SCHEMBL6744755 | 0.84 | KDM4E (0.52) | NUDT1BACE1HSP90AA1THRBACMSD | |
| SCHEMBL13038540 | 0.81 | KDM4E (0.53) | NUDT1BACE1HSP90AA1THRBACMSD | |
| SCHEMBL23776852 | 0.80 | KDM4E (0.58) | BACE1HSP90AA1THRBKMT2ATP53 | |
| SCHEMBL1068254 | 0.79 | NUDT1 (0.57) | NUDT1BACE1HSP90AA1THRBACMSD | |
| SCHEMBL69755 | 0.79 | NUDT1 (0.57) | NUDT1BACE1HSP90AA1THRBACMSD | |
| SCHEMBL19227021 | 0.77 | PTGS1 (0.45) | LCKNQO2KMT2AALOX5 | |
| SCHEMBL19227017 | 0.77 | PTGS1 (0.45) | LCKNQO2KMT2AALOX5 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20110163461-A1 | ELECTRONIC PACKAGING | EVONIK DEGUSSA GMBH (DE) | 2011-07-07 | — | — | US | claimed |
| US-20110163461-A1 | ELECTRONIC PACKAGING | EVONIK DEGUSSA GMBH (DE) | 2011-07-07 | — | — | US | disclosed |
| EP-2119737-B1 | Electronic packaging | EVONIK DEGUSSA GMBH (DE) | 2011-05-04 | — | — | EP | disclosed |
| EP-2119737-A1 | Electronic packaging | Evonik Degussa GmbH (DE) | 2009-11-18 | — | — | EP | disclosed |
| EP-0869140-B1 | Epoxy resin composition and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL CO (JP) | 2003-08-13 | — | — | EP | disclosed |
| US-6190786-B1 | BIS(GLYCIDYLOXY)STILBENE RESINS | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 2001-02-20 | — | — | US | disclosed |
| US-5939509-A | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 1999-08-17 | — | — | US | disclosed |
| US-5939473-A | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-08-17 | — | — | US | disclosed |
| EP-0739877-B1 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL CO (JP) | 1999-08-04 | — | — | EP | disclosed |
| US-5854370-A | Epoxy resin stilbenes and process for producing the same by photoisomerization | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-12-29 | — | — | US | disclosed |
| EP-0869140-A2 | Epoxy resin composition and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-10-07 | — | — | EP | disclosed |
| US-5705596-A | STILBENE COMPOUNDS FOR ADHESIVES, PAINTS, ELECTRONICS AND INSULATION OF LAMINATES | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-01-06 | — | — | US | disclosed |
| EP-0739877-A2 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 1996-10-30 | — | — | EP | disclosed |