SCHEMBL18232240

SCHEMBL18232240

CO[Si](C)(CCCOCC1CO1)O[Si](C)(OC)OC

nearest known ligand 0.52

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.52
ALDH1A1 P00352 4/20 0.51
TDP1 Q9NUW8 1/20 0.51
SMN1; SMN2 Q16637 1/20 0.50
MAPK1 P28482 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL661890 0.92 TSHR (0.57) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL18101818 0.89 TSHR (0.61) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL11019593 0.89 TSHR (0.61) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL28064 0.89 TSHR (0.61) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
Phosphine SCHEMBL22165491 0.87 TSHR (0.59) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL21373926 0.86 TSHR (0.50) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL187760 0.85 TSHR (0.57) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL29223191 0.85 TSHR (0.57) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL26363951 0.85 TSHR (0.49) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL5605557 0.83 TSHR (0.64) TSHRALDH1A1TDP1SMN1; SMN2MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9944049-B2 Composition for forming release layer, release layer, laminate including release layer, method of preparing laminate, and method of treating laminate TOKYO OHKA KOGYO CO., LTD. (JP) 2018-04-17 US disclosed
US-20160343601-A1 METHOD OF PREPARING LAMINATE, AND METHOD OF SEPARATING SUPPORT TOKYO OHKA KOGYO CO., LTD. (JP) 2016-11-24 US disclosed
US-20160332421-A1 COMPOSITION FOR FORMING RELEASE LAYER, RELEASE LAYER, LAMINATE INCLUDING RELEASE LAYER, METHOD OF PREPARING LAMINATE, AND METHOD OF TREATING LAMINATE TOKYO OHKA KOGYO CO., LTD. (JP) 2016-11-17 US disclosed