Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GABRA1 | P14867 | 1/20 | 0.50 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.50 |
| ▸ | CA2 | P00918 | 3/20 | 0.46 |
| ▸ | PTGS1 | P23219 | 4/20 | 0.42 |
| ▸ | PTGS2 | P35354 | 4/20 | 0.42 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.41 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.41 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.40 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.40 |
| ▸ | TYR | P14679 | 2/20 | 0.40 |
| ▸ | POLB | P06746 | 1/20 | 0.40 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.38 |
| ▸ | CA1 | P00915 | 1/20 | 0.37 |
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | GABBR2 | O75899 | 1/20 | 0.35 |
| ▸ | GABBR1 | Q9UBS5 | 1/20 | 0.35 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1823721 | 1.00 | GABRA1 (0.50) | GABRA1GABRB2CA2PTGS1PTGS2 | |
| SCHEMBL1825679 | 0.88 | PTGS1 (0.50) | PTGS1PTGS2ALOX5 | |
| SCHEMBL1825677 | 0.88 | PTGS1 (0.50) | PTGS1PTGS2ALOX5 | |
| SCHEMBL311508 | 0.84 | GABRA1 (0.47) | GABRA1GABRB2CA2PTGS1PTGS2 | |
| SCHEMBL1824887 | 0.84 | ALOX15 (0.41) | GABRA1GABRB2CA2PTGS1PTGS2 | |
| SCHEMBL1824884 | 0.84 | ALOX15 (0.41) | GABRA1GABRB2CA2PTGS1PTGS2 | |
| SCHEMBL3461711 | 0.78 | GABRA1 (0.64) | GABRA1GABRB2CA2PTGS1PTGS2 | |
| SCHEMBL30229685 | 0.76 | GABRA1 (0.56) | GABRA1GABRB2CA2PTGS1PTGS2 | |
| SCHEMBL2340618 | 0.76 | GABRA1 (0.56) | GABRA1GABRB2CA2PTGS1PTGS2 | |
| SCHEMBL144172 | 0.76 | GABRA1 (0.56) | GABRA1GABRB2CA2PTGS1PTGS2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20110163461-A1 | ELECTRONIC PACKAGING | EVONIK DEGUSSA GMBH (DE) | 2011-07-07 | — | — | US | claimed |
| US-5939473-A | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-08-17 | — | — | US | claimed |
| EP-0739877-B1 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL CO (JP) | 1999-08-04 | — | — | EP | claimed |
| EP-0739877-A2 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 1996-10-30 | — | — | EP | claimed |
| US-20110163461-A1 | ELECTRONIC PACKAGING | EVONIK DEGUSSA GMBH (DE) | 2011-07-07 | — | — | US | disclosed |
| EP-2119737-B1 | Electronic packaging | EVONIK DEGUSSA GMBH (DE) | 2011-05-04 | — | — | EP | disclosed |
| EP-2119737-A1 | Electronic packaging | Evonik Degussa GmbH (DE) | 2009-11-18 | — | — | EP | disclosed |
| EP-0869148-B1 | Epoxy resin composition and method for producing the same | SUMITOMO CHEMICAL CO (JP) | 2004-03-03 | — | — | EP | disclosed |
| EP-0869140-B1 | Epoxy resin composition and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL CO (JP) | 2003-08-13 | — | — | EP | disclosed |
| US-6255409-B1 | EPOXY RESIN COMPOSITION COMPRISING BIFUNCTIONAL CRYSTALLINE EPOXY COMPOUND, AMORPHOUS TRISPHENOLMETHANE TYPE EPOXY COMPOUND HAVING THREE OR MORE EPOXY GROUPS IN MOLECULE, AND EPOXY CURING AGENT HAVING PHENOLIC HYDROXYL GROUPS | SUMITOMO CHEMICAL CO., LTD. (JP) | 2001-07-03 | — | — | US | disclosed |
| US-6190786-B1 | BIS(GLYCIDYLOXY)STILBENE RESINS | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 2001-02-20 | — | — | US | disclosed |
| US-5969060-A | MIXING WITH CONTROLLED HEATING BETWEEN MELTING POINT OF CRYSTALLINE EPOXY RESIN AND SOFTENING POINT OF AMORPHOUS EPOXY RESIN YIELDS UNIFORM DISPERSION, FOR PAINTS, ADHESIVES, ENCAPSULATION OF SEMICONDUCTORS | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-10-19 | — | — | US | disclosed |
| US-5939509-A | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 1999-08-17 | — | — | US | disclosed |
| US-5939473-A | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-08-17 | — | — | US | disclosed |
| EP-0739877-B1 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL CO (JP) | 1999-08-04 | — | — | EP | disclosed |
| US-5854370-A | Epoxy resin stilbenes and process for producing the same by photoisomerization | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-12-29 | — | — | US | disclosed |
| EP-0869140-A2 | Epoxy resin composition and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-10-07 | — | — | EP | disclosed |
| EP-0869148-A1 | Epoxy resin composition and method for producing the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-10-07 | — | — | EP | disclosed |
| US-5705596-A | STILBENE COMPOUNDS FOR ADHESIVES, PAINTS, ELECTRONICS AND INSULATION OF LAMINATES | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-01-06 | — | — | US | disclosed |
| EP-0739877-A2 | Epoxy resin, resin composition, and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 1996-10-30 | — | — | EP | disclosed |