SCHEMBL1825877

SCHEMBL1825877

Cc1cc(/C=C/c2ccc(O)cc2)ccc1O

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
BACE1 P56817 1/20 0.70
NQO2 P16083 3/20 0.67
LCK P06239 2/20 0.67
PTGS1 P23219 4/20 0.54
MAPT P10636 4/20 0.54
APP P05067 3/20 0.54
KDM4E B2RXH2 3/20 0.54
MEN1 O00255 3/20 0.54
KMT2A Q03164 3/20 0.54
ALOX5 P09917 3/20 0.54
PTGS2 P35354 3/20 0.54
NPC1 O15118 3/20 0.54
CA12 O43570 2/20 0.54
CA1 P00915 2/20 0.54
CA2 P00918 2/20 0.54
CA3 P07451 2/20 0.54
CA4 P22748 2/20 0.54
CA6 P23280 2/20 0.54
CA5A P35218 2/20 0.54
CA7 P43166 2/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1825879 1.00 BACE1 (0.70) BACE1NQO2LCKPTGS1MAPT
SCHEMBL1824384 0.91 LCK (0.61) BACE1NQO2LCKPTGS1MAPT
SCHEMBL1824386 0.91 LCK (0.61) BACE1NQO2LCKPTGS1MAPT
SCHEMBL172757 0.86 ALOX5 (0.66) BACE1NQO2LCKPTGS1APP
SCHEMBL17356222 0.86 KDM4E (0.68) BACE1NQO2LCKPTGS1MAPT
SCHEMBL30940359 0.85 TUBB1 (0.58) BACE1NQO2LCKPTGS1MAPT
SCHEMBL18130045 0.85 TUBB1 (0.58) BACE1NQO2LCKPTGS1MAPT
SCHEMBL18130043 0.85 TUBB1 (0.58) BACE1NQO2LCKPTGS1MAPT
SCHEMBL25856434 0.84 BACE1 (0.53) BACE1NQO2LCKPTGS1ALOX5
SCHEMBL1824534 0.83 BACE1 (0.53) BACE1NQO2LCKPTGS1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20110163461-A1 ELECTRONIC PACKAGING EVONIK DEGUSSA GMBH (DE) 2011-07-07 US claimed
US-20110163461-A1 ELECTRONIC PACKAGING EVONIK DEGUSSA GMBH (DE) 2011-07-07 US disclosed
EP-2119737-B1 Electronic packaging EVONIK DEGUSSA GMBH (DE) 2011-05-04 EP disclosed
EP-2119737-A1 Electronic packaging Evonik Degussa GmbH (DE) 2009-11-18 EP disclosed
EP-0869140-B1 Epoxy resin composition and resin-encapsulated semiconductor device SUMITOMO CHEMICAL CO (JP) 2003-08-13 EP disclosed
US-6255409-B1 EPOXY RESIN COMPOSITION COMPRISING BIFUNCTIONAL CRYSTALLINE EPOXY COMPOUND, AMORPHOUS TRISPHENOLMETHANE TYPE EPOXY COMPOUND HAVING THREE OR MORE EPOXY GROUPS IN MOLECULE, AND EPOXY CURING AGENT HAVING PHENOLIC HYDROXYL GROUPS SUMITOMO CHEMICAL CO., LTD. (JP) 2001-07-03 US disclosed
US-6190786-B1 BIS(GLYCIDYLOXY)STILBENE RESINS SUMITOMO CHEMICAL COMPANY, LTD. (JP) 2001-02-20 US disclosed
EP-0943639-A2 Epoxy resin composition and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1999-09-22 EP disclosed
EP-0869140-A2 Epoxy resin composition and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-10-07 EP disclosed