SCHEMBL1827344

SCHEMBL1827344

CCC(CO)(CO)CO.CCOC(OCC)=C(C(=O)O)C(OCC)(OCC)OCC

nearest known ligand 0.30

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.30
PKM P14618 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL433368 0.81 ALDH1A1 (0.31)
SCHEMBL8711316 0.76 ALDH1A1 (0.33) KDM4EPKM
SCHEMBL1825226 0.75
SCHEMBL28199299 0.71 ALDH1A1 (0.35) KDM4EPKM
SCHEMBL2519775 0.70 ALDH1A1 (0.34) KDM4EPKM
SCHEMBL4583441 0.70 ALDH1A1 (0.34) KDM4EPKM
SCHEMBL1827427 0.70
Oxalic Acid SCHEMBL28437631 0.70 FFAR3 (0.35)
Ethyl Acetate SCHEMBL17840978 0.69 ALDH1A1 (0.64) KDM4EPKM
SCHEMBL1476337 0.69 SOAT1 (0.32) KDM4EPKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2357521-B1 Photosensitive conductive film, method of forming a conductive film substrate and method of forming a conductive pattern substrate HITACHI CHEMICAL CO LTD (JP) 2016-11-02 EP disclosed
US-9161442-B2 Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate HITACHI CHEMICAL COMPANY, LTD. (JP) 2015-10-13 US disclosed
US-9119310-B2 2015-08-25 US disclosed
US-8840992-B2 Curable resin composition and optical film JNC CORPORATION (JP) 2014-09-23 US disclosed
US-20140124253-A1 PHOTOSENSITIVE CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE PATTERN, AND CONDUCTIVE FILM SUBSTRATE HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-05-08 US disclosed
US-8674233-B2 Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-03-18 US disclosed
EP-2320433-B1 METHOD OF FORMING A CONDUCTIVE PATTERN HITACHI CHEMICAL CO LTD (JP) 2013-04-24 EP disclosed
US-8426741-B2 Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-04-23 US disclosed
US-20120138348-A1 PHOTOSENSITIVE CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE PATTERN, AND CONDUCTIVE FILM SUBSTRATE RESONAC CORPORATION (JP) 2012-06-07 US disclosed
US-8171628-B2 Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-05-08 US disclosed
EP-2357521-A1 Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate Hitachi Chemical Co., Ltd. (JP) 2011-08-17 EP disclosed
US-20110189470-A1 CURABLE RESIN COMPOSITION AND OPTICAL FILM CHISSO CORPORATION (JP) 2011-08-04 US disclosed
US-20110165514-A1 PHOTOSENSITIVE CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE PATTERN, AND CONDUCTIVE FILM SUBSTRATE RESONAC CORPORATION (JP) 2011-07-07 US disclosed
US-20110147054-A1 PHOTOSENSITIVE CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE PATTERN, AND CONDUCTIVE FILM SUBSTRATE RESONAC CORPORATION (JP) 2011-06-23 US disclosed
EP-2320433-A1 PHOTOSENSITIVE CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE PATTERN, AND CONDUCTIVE FILM SUBSTRATE Hitachi Chemical Company, Ltd. (JP) 2011-05-11 EP disclosed