Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | TP53 | P04637 | 1/20 | 0.31 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.31 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1827344 | 0.81 | KDM4E (0.30) | — | |
| SCHEMBL433986 | 0.78 | ALDH1A1 (0.36) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL8711311 | 0.78 | ALDH1A1 (0.34) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL1476339 | 0.74 | ALDH1A1 (0.33) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL434900 | 0.74 | ALDH1A1 (0.33) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL4583431 | 0.72 | ALDH1A1 (0.39) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL30511822 | 0.70 | KDM4E (0.37) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL30451 | 0.68 | THRB (0.44) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL169118 | 0.68 | ALDH1A1 (0.37) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL10637666 | 0.67 | MEN1 (0.41) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11999157-B2 | Transfer film, laminate, acoustic speaker, and method for producing laminate | FUJIFILM CORPORATION (JP) | 2024-06-04 | — | — | US | disclosed |
| WO-2024024842-A1 | LAMINATE MANUFACTURING METHOD | 富士フイルム株式会社 | 2024-02-01 | — | — | WO | disclosed |
| US-20240027897-A1 | LAMINATE AND MANUFACTURING METHOD OF LAMINATE | FUJIFILM CORPORATION (JP) | 2024-01-25 | — | — | US | disclosed |
| WO-2024004492-A1 | PHOTOSENSITIVE COMPOSITION, TRANSFER FILM, LAMINATE, AND METHOD FOR MANUFACTURING SAME, AND MICRO LED DISPLAY | 富士フイルム株式会社 | 2024-01-04 | — | — | WO | disclosed |
| US-20240004291-A1 | COMPOSITION, TRANSFER FILM, MANUFACTURING METHOD OF LAMINATE, CURED FILM, AND DEVICE | FUJIFILM CORPORATION (JP) | 2024-01-04 | — | — | US | disclosed |
| WO-2023127889-A1 | TRANSFER FILM, LAMINATE MANUFACTURING METHOD, LAMINATE, AND MICRO-LED DISPLAY ELEMENT | 富士フイルム株式会社 | 2023-07-06 | — | — | WO | disclosed |
| WO-2023100553-A1 | TRANSFER FILM, LAMINATE HAVING CONDUCTOR PATTERN, METHOD FOR PRODUCING LAMINATE HAVING CONDUCTOR PATTERN, AND METHOD FOR PRODUCING TRANSFER FILM | 富士フイルム株式会社 | 2023-06-08 | — | — | WO | disclosed |
| US-20230100327-A1 | COMPOSITION, DRIED PRODUCT, CURED SUBSTANCE, TRANSFER FILM, MANUFACTURING METHOD OF TRANSFER FILM, AND PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2023-03-30 | — | — | US | disclosed |
| US-20230097968-A1 | PHOTOSENSITIVE TRANSFER MATERIAL, LIGHT SHIELDING MATERIAL, LED ARRAY, AND ELECTRONIC APPARATUS | FUJIFILM CORPORATION (JP) | 2023-03-30 | — | — | US | disclosed |
| US-20230094866-A1 | PHOTOSENSITIVE TRANSFER MATERIAL FOR LED ARRAY, LIGHT SHIELDING MATERIAL FOR LED ARRAY, LED ARRAY, AND ELECTRONIC APPARATUS | FUJIFILM CORPORATION (JP) | 2023-03-30 | — | — | US | disclosed |
| EP-2103636-A1 | FLUORINE-CONTAINING POLYMER AND RESIN COMPOSITION | Chisso Corporation (JP) | 2009-09-23 | — | — | EP | disclosed |
| EP-1825328-B1 | PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM BY THE USE THEREOF | TOKYO OHKA KOGYO CO LTD (JP) | 2009-04-15 | — | — | EP | disclosed |
| US-20090068600-A1 | METHOD FOR ENHANCING OPTICAL STABILITY OF THREE-DIMENSIONAL MICROMOLDED PRODUCT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-03-12 | — | — | US | disclosed |
| US-20070292804-A1 | Photosensitive Resin Composition and Photosensitive Dry Film by the Use Thereof | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-12-20 | — | — | US | disclosed |
| US-20060177762-A1 | Negative photosensitive resin composition and negative photosensitive element | HITACHI CHEMICAL CO., LTD. (JP) | 2006-08-10 | — | — | US | disclosed |
| US-7067226-B2 | Photosensitive film for circuit formation and process for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2006-06-27 | — | — | US | disclosed |
| US-20040112859-A1 | Photosensitive film for circuit formation and process for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2004-06-17 | — | — | US | disclosed |
| US-6733873-B2 | SATISFIES REQUIREMENTS FOR TRANSPARENCY, SLIPPERINESS, WINDING PROPERTIES, RESOLUTION AND RECYCLABILITY; RESIDUAL POLYCONDENSATION METAL CATALYST CONTENT OF LESS THAN 150 PPM, AND AN ANTIMONY CONTENT OF 15 MMOL % OR LESS | TEIJIN LIMITED (JP) | 2004-05-11 | — | — | US | disclosed |
| US-20020197496-A1 | Polyester film as support for dry film resist | TEIJIN LIMITED (JP) | 2002-12-26 | — | — | US | disclosed |
| EP-1266923-A1 | POLYESTER FILM AS SUPPORT FOR DRY FILM RESIST | TEIJIN LIMITED (JP) | 2002-12-18 | — | — | EP | disclosed |