SCHEMBL1831941

SCHEMBL1831941

O=S(=O)(O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F.[BaH2]

nearest known ligand 0.52

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
CA2 P00918 14/20 0.52
CA1 P00915 13/20 0.52
MMP1 P03956 6/20 0.52
MMP2 P08253 6/20 0.52
MMP9 P14780 6/20 0.52
MMP8 P22894 6/20 0.52
MMP13 P45452 6/20 0.52
F2 P00734 4/20 0.46
PRSS1 P07477 4/20 0.46
PRSS2 P07478 4/20 0.46
PRSS3 P35030 4/20 0.46
ALDH1A1 P00352 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
THRB P10828 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2998353 0.97 CA2 (0.54) CA2CA1MMP1MMP2MMP9
SCHEMBL3005918 0.97 CA2 (0.54) CA2CA1MMP1MMP2MMP9
SCHEMBL23932 0.97 CA2 (0.54) CA2CA1MMP1MMP2MMP9
SCHEMBL30354089 0.97 CA2 (0.54) CA2CA1MMP1MMP2MMP9
SCHEMBL6912911 0.94 CA2 (0.52) CA2CA1MMP1MMP2MMP9
SCHEMBL6915199 0.94 CA2 (0.52) CA2CA1MMP1MMP2MMP9
SCHEMBL3137344 0.94 CA2 (0.56) CA2CA1MMP1MMP2MMP9
SCHEMBL8437168 0.94 CA2 (0.56) CA2CA1MMP1MMP2MMP9
SCHEMBL6916713 0.94 CA2 (0.52) CA2CA1MMP1MMP2MMP9
SCHEMBL615754 0.94 CA2 (0.56) CA2CA1MMP1MMP2MMP9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9570211-B2 Transparent thermoplastic composition with improved electrical conductivity in the melt COVESTRO LLC (US) 2017-02-14 US claimed
EP-2318459-A2 TRANSPARENT THERMOPLASTIC COMPOSITION WITH IMPROVED ELECTRICAL CONDUCTIVITY IN THE MELT Bayer MaterialScience LLC (US) 2011-05-11 EP claimed
WO-2010027417-A2 TRANSPARENT THERMOPLASTIC COMPOSITION WITH IMPROVED ELECTRICAL CONDUCTIVITY IN THE MELT BAYER MATERIALSCIENCE LLC (US) 2010-03-11 WO claimed
US-20100051882-A1 TRANSPARENT THERMOPLASTIC COMPOSITION WITH IMPROVED ELECTRICAL CONDUCTIVITY IN THE MELT COVESTRO LLC 2010-03-04 US claimed
EP-4479476-A1 FLAME-RETARDANT POLYCARBONATE COMPOSITION Covestro Deutschland AG (DE) 2024-12-25 EP disclosed
CN-118696093-A Flame retardant polycarbonate compositions 科思创德国股份有限公司 2024-09-24 CN disclosed
EP-4204492-B1 HYDROLYSIS-RESISTANT POLYCARBONATE COMPOSITION COVESTRO DEUTSCHLAND AG (DE) 2024-06-26 EP disclosed
EP-3967724-B1 POLYCARBONATE RESIN COMPOSITION MITSUBISHI ENG PLASTICS CORP (JP) 2024-02-28 EP disclosed
US-20230312918-A1 Hydrolysis-Resistant Polycarbonate Composition COVESTRO DEUTSCHLAND AG (DE) 2023-10-05 US disclosed
WO-2023156339-A1 FLAME-RETARDANT POLYCARBONATE COMPOSITION COVESTRO DEUTSCHLAND AG (DE) 2023-08-24 WO disclosed
EP-4230697-A1 HYDROLYSIS-RESISTANT POLYCARBONATE COMPOSITION Covestro Deutschland AG (DE) 2023-08-23 EP disclosed
EP-4204492-A1 HYDROLYSIS-RESISTANT POLYCARBONATE COMPOSITION Covestro Deutschland AG (DE) 2023-07-05 EP disclosed
EP-2570458-A1 Polycarbonate resin composition and formed product thereof Mitsubishi Engineering- Plastics Corporation (JP) 2013-03-20 EP disclosed
US-20120301766-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2012-11-29 US disclosed
EP-2520617-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE Mitsubishi Engineering-Plastics Corporation (JP) 2012-11-07 EP disclosed
EP-2336247-B1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI ENG PLASTICS CORP (JP) 2012-07-25 EP disclosed
US-20120129990-A1 HIGH-THERMAL-CONDUCTIVITY POLYCARBONATE RESIN COMPOSITION AND FORMED PRODUCT MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2012-05-24 US disclosed
US-20110245388-A1 POLYCARBONATE RESIN COMPOSITION AND FORMED PRODUCT THEREOF MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2011-10-06 US disclosed
US-20110207846-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2011-08-25 US disclosed
EP-2336247-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE Mitsubishi Engineering-Plastics Corporation (JP) 2011-06-22 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20110245388-A1 POLYCARBONATE RESIN COMPOSITION AND FORMED PRODUCT THEREOF PTCD3, PSMC2, COPE CA2 1319/4885CA1 1051/4885MMP1 3937/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.