SCHEMBL18328646

SCHEMBL18328646

c1ccc2c(c1)CN(c1ccc(Oc3ccc(Cc4ccc(Oc5ccc(N6COc7ccccc7C6)cc5)cc4)cc3)cc1)CO2

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 2/20 0.41
RAB9A P51151 2/20 0.41
ALDH1A1 P00352 1/20 0.41
TP53 P04637 1/20 0.41
MAPT P10636 1/20 0.41
BACE1 P56817 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
KDM4E B2RXH2 1/20 0.41
LTA4H P09960 5/20 0.36
SRD5A2 P31213 1/20 0.36
MEN1 O00255 1/20 0.34
GAA P10253 1/20 0.34
KMT2A Q03164 1/20 0.34
CYP3A4 P08684 1/20 0.33
CYP2D6 P10635 1/20 0.33
HIF1A Q16665 1/20 0.33
HRH1 P35367 1/20 0.32
HRH3 Q9Y5N1 1/20 0.32
LIPE Q05469 1/20 0.32
IDH1 O75874 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15358692 0.92 NPC1 (0.47) NPC1RAB9AALDH1A1TP53MAPT
SCHEMBL13203360 0.92 NPC1 (0.44) NPC1RAB9AALDH1A1TP53MAPT
SCHEMBL15358745 0.92 NPC1 (0.47) NPC1RAB9AALDH1A1TP53MAPT
SCHEMBL95039 0.92 NPC1 (0.44) NPC1RAB9AALDH1A1TP53MAPT
SCHEMBL15202644 0.89 MEN1 (0.41) NPC1RAB9AALDH1A1TP53MAPT
SCHEMBL14374001 0.89 NPC1 (0.45) NPC1RAB9AALDH1A1TP53MAPT
SCHEMBL15358724 0.87 NPC1 (0.41) NPC1RAB9AALDH1A1TP53MAPT
SCHEMBL15358725 0.87 NPC1 (0.44) NPC1RAB9AALDH1A1TP53MAPT
SCHEMBL19404937 0.85 RAB9A (0.39) NPC1RAB9AALDH1A1TP53MAPT
SCHEMBL15358747 0.85 LTA4H (0.40) NPC1RAB9AALDH1A1TP53MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10224259-B2 Resin composition for sealing semiconductor and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2019-03-05 US disclosed
EP-3012295-B1 RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO (JP) 2017-11-22 EP disclosed
US-20160372394-A1 RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2016-12-22 US disclosed
US-20160372394-A1 RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2016-12-22 US disclosed