SCHEMBL1834022

SCHEMBL1834022

CCC[N+](CC)(C(C)C)C(C)C

nearest known ligand 0.37

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
SLC22A1 O15245 1/20 0.37
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1841104 0.87 SLC22A1 (0.41) SLC22A1TSHR
SCHEMBL51908 0.79 TSHR (0.33) TSHR
SCHEMBL302025 0.78 DNM1 (0.50) SLC22A1TSHR
SCHEMBL25943175 0.77 SLC22A1 (0.33) SLC22A1
Bromide SCHEMBL28460603 0.76 TSHR (0.31) TSHR
SCHEMBL1832260 0.73 SLC22A1 (0.41) SLC22A1TSHR
SCHEMBL16784110 0.69
SCHEMBL19409368 0.69
SCHEMBL1833510 0.69 SLC22A1 (0.44) SLC22A1TSHR
SCHEMBL16168029 0.69 TSHR (0.37) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3042939-B1 ADHESIVE COMPOSITION TOAGOSEI CO LTD (JP) 2021-06-23 EP disclosed
EP-3042933-B1 CURABLE RESIN COMPOSITION TOAGOSEI CO LTD (JP) 2020-09-30 EP disclosed
WO-2020071553-A1 ADHESIVE COMPOSITION FOR ASSEMBLING SPEAKER, METHOD FOR ASSEMBLING SPEAKER, AND SPEAKER 東亞合成株式会社 2020-04-09 WO disclosed
EP-2896668-B1 2-CYANOACRYLATE-BASED ADHESIVE COMPOSITION TOAGOSEI CO LTD (JP) 2019-11-13 EP disclosed
EP-3231818-B1 TWO-PART CURABLE COMPOSITION TOAGOSEI CO LTD (JP) 2019-08-14 EP disclosed
CN-105579537-B Adhesive composite 东亚合成株式会社 2018-11-27 CN disclosed
EP-2832728-B1 TRIAZINONE COMPOUND AND T-TYPE CALCIUM CHANNEL INHIBITOR NISSAN CHEMICAL IND LTD (JP) 2018-09-05 EP disclosed
US-9994662-B2 Two-part curable composition TOAGOSEI CO., LTD. (JP) 2018-06-12 US disclosed
EP-2933302-B1 ADHESIVE COMPOSITION TOAGOSEI CO LTD (JP) 2018-04-04 EP disclosed
US-9932447-B2 Curable resin composition TOAGOSEI CO., LTD. (JP) 2018-04-03 US disclosed
US-20070188979-A1 ELECTROLYTE FOR ELECTROLYTIC CAPACITOR, ELECTROLYTIC CAPACITOR AND PROCESS FOR PRODUCING TETRAFLUOROALUMINATE SALT OF ORGANIC ONIUM MITSUBISHI CHEMICAL CORPORATION (JP) 2007-08-16 US disclosed
US-7227738-B2 Electrolyte for electrolytic capacitor, electrolytic capacitor and process for producing tetrafluoroaluminate salt of organic onium MITSUBISHI CHEMICAL CORPORATION (JP) 2007-06-05 US disclosed
US-20070002522-A1 Electric double layer capacitor and electrolytic solution therefor MITSUBISHI CHEMICAL CORPORATION (JP) 2007-01-04 US disclosed
US-20060262485-A1 Electric double layer capacitor and electrolytic solution therefor MITSUBISHI CHEMICAL CORPORATION (JP) 2006-11-23 US disclosed
US-7072173-B2 Electrolyte for electrolytic capacitor and electrolytic capacitor using the same MITSUBISHI CHEMICAL CORPORATION (JP) 2006-07-04 US disclosed
US-20060092597-A1 Electrolyte for electrolytic capacitor and electrolytic capacitor using the same MITSUBISHI CHEMICAL CORPORATION (JP) 2006-05-04 US disclosed
US-20060007629-A1 Electrolyte for electrolytic capacitor, electrolytic capacitor and process for producing tetrafluoroaluminate salt of organic onium MITSUBISHI CHEMICAL CORPORATION (JP) 2006-01-12 US disclosed
EP-1564768-A1 ELECTROLYTE FOR ELECTROLYTIC CAPACITOR, ELECTROLYTIC CAPACITOR AND PROCESS FOR PRODUCING TETRAFLUOROALUMINATE SALT OF ORGANIC ONIUM Mitsubishi Chemical Corporation (JP) 2005-08-17 EP disclosed
US-20040095708-A1 Electrolyte for electolytic capacitor and electrolytic capacitor using the same MITSUBISHI CHEMICAL CORPORATION (JP) 2004-05-20 US disclosed
EP-1394824-A1 ELECTROLYTIC SOLUTION FOR ELECTROLYTIC CAPACITOR AND ELECTROLYTIC CAPACITOR USING IT Mitsubishi Chemical Corporation (JP) 2004-03-03 EP disclosed