SCHEMBL1838368

SCHEMBL1838368

CC(C)(C)Oc1ccccc1P(c1ccccc1OC(C)(C)C)c1ccccc1OC(C)(C)C

nearest known ligand 0.36

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
KCNH2 Q12809 1/20 0.36
CA12 O43570 1/20 0.35
CA1 P00915 1/20 0.35
CA2 P00918 1/20 0.35
CA4 P22748 1/20 0.35
CA7 P43166 1/20 0.35
CA9 Q16790 1/20 0.35
CA14 Q9ULX7 1/20 0.35
KDM4E B2RXH2 1/20 0.31
ALDH1A1 P00352 1/20 0.31
HSD17B10 Q99714 1/20 0.31
KIF11 P52732 1/20 0.31
MAPK1 P28482 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30574285 1.00 KCNH2 (0.36) KCNH2CA12CA1CA2CA4
SCHEMBL1837567 0.88 CYP3A4 (0.41) KCNH2CA12CA1CA2CA4
SCHEMBL2153874 0.84 KCNH2 (0.35) KCNH2CA12CA1CA2CA4
SCHEMBL2153865 0.83 KCNH2 (0.34) KCNH2CA12CA1CA2CA4
SCHEMBL29428931 0.80 CA1 (0.45) KCNH2CA12CA1CA2CA4
SCHEMBL3820431 0.80 CA1 (0.45) KCNH2CA12CA1CA2CA4
SCHEMBL2154131 0.78 KCNH2 (0.32) KCNH2KDM4EALDH1A1HSD17B10
SCHEMBL1838651 0.77 GAA (0.37) KDM4EALDH1A1
SCHEMBL2155672 0.77 ALDH1A1 (0.33) KCNH2KDM4EALDH1A1HSD17B10
SCHEMBL27970886 0.74 RIPK1 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3620459-B9 PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON STEEL CHEMICAL & MAT CO LTD (JP) 2023-10-04 EP disclosed
EP-3620459-B1 PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON STEEL CHEMICAL & MAT CO LTD (JP) 2023-05-24 EP disclosed
CN-112694599-A Phenoxy resin, method for producing same, resin composition thereof, and cured product 日铁化学材料株式会社 2021-04-23 CN disclosed
EP-3620459-A1 PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON STEEL Chemical & Material Co., Ltd. (JP) 2020-03-11 EP disclosed
EP-2321244-B1 IMPROVED PROCESS FOR TELOMERIZATION OF BUTADIENE DOW GLOBAL TECHNOLOGIES LLC (US) 2016-12-21 EP disclosed
EP-1788014-B1 Thermosensitive adhesive composition, method of manufacturing the same and thermosensitive adhesive article RICOH CO LTD (JP) 2016-03-09 EP disclosed
US-8558030-B2 Process for telomerization of butadiene DOW GLOBAL TECHNOLOGIES LLC (US) 2013-10-15 US disclosed
US-7989529-B2 Thermosensitive adhesive composition, method of manufacturing the same and thermosensitive adhesive material RICOH COMPANY, LTD. (JP) 2011-08-02 US disclosed
US-20110137086-A1 PROCESS FOR TELOMERIZATION OF BUTADIENE Dow Global Technologies LLC (Formerly known as Dow Global Technologies Inc.) (US) 2011-06-09 US disclosed
EP-2321244-A2 AN IMPROVED PROCESS FOR TELOMERIZATION OF BUTADIENE Dow Global Technologies LLC (US) 2011-05-18 EP disclosed
WO-2010019360-A2 AN IMPROVED PROCESS FOR TELOMERIZATION OF BUTADIENE DOW GLOBAL TECHNOLOGIES INC. (US) 2010-02-18 WO disclosed
EP-1788014-A1 Thermosensitive adhesive composition, method of manufacturing the same and thermosensitive adhesive article Ricoh Company, Ltd. (JP) 2007-05-23 EP disclosed
US-20070112113-A1 Thermosensitive adhesive composition, method of manufacturing the same and thermosensitive adhesive material RICOH COMPANY, LTD. 2007-05-17 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20110137086-A1 PROCESS FOR TELOMERIZATION OF BUTADIENE HRH3, HRH4, TELO2 KCNH2 4513/4885CA12 4195/4885CA1 4615/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.