Bicarbonate

Bicarbonate

SCHEMBL1839991

COC(C)(C)CCOO.O=C(O)O.O=C(O)O

nearest known ligand 0.35

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Known targets — ChEMBL curated mechanism

GSK3AGSK3BIMPA1

The experimentally established mechanism targets of Bicarbonate. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.35
TSHR P16473 1/20 0.35
TDP1 Q9NUW8 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Bicarbonate SCHEMBL95313 1.00 ALDH1A1 (0.35) ALDH1A1TSHRTDP1
SCHEMBL28284161 0.91
Bicarbonate SCHEMBL29117102 0.82 TSHR (0.31) TSHR
Bicarbonate SCHEMBL1062002 0.82 TSHR (0.31) TSHR
Bicarbonate SCHEMBL239115 0.77 TSHR (0.32) ALDH1A1TSHRTDP1
SCHEMBL29546719 0.74 ALDH1A1 (0.36) ALDH1A1TSHRTDP1
SCHEMBL12330817 0.74 ALDH1A1 (0.36) ALDH1A1TSHRTDP1
SCHEMBL12301938 0.74 ALDH1A1 (0.32) ALDH1A1TSHRTDP1
SCHEMBL1645934 0.74 TSHR (0.32) ALDH1A1TSHRTDP1
Acetic Acid SCHEMBL29199856 0.74 ALDH1A1 (0.40) ALDH1A1TSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 122 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119923449-A Adhesive composition, adhesive film, connection structure, and method for producing same 株式会社力森诺科 2025-05-02 CN disclosed
CN-119409905-A Composition and sheet 株式会社力森诺科 2025-02-11 CN disclosed
CN-116710508-B Composition and sheet 株式会社力森诺科 2024-11-15 CN disclosed
CN-115916894-B Curable resin, composition, cured product, varnish, prepreg, and circuit board DIC株式会社 2024-07-26 CN disclosed
CN-118284635-A Photocurable resin composition, fuel cell, and sealing method 三键有限公司 2024-07-02 CN disclosed
CN-118259564-A Toner and method for producing toner 佳能株式会社 2024-06-28 CN disclosed
CN-111205788-B Anisotropic film and method for producing anisotropic film 信越化学工业株式会社 2024-06-07 CN disclosed
CN-113166339-B Curable resin composition, fuel cell, and sealing method 三键有限公司 2024-03-19 CN disclosed
CN-117651730-A Resin composition and adhesive 纳美仕有限公司 2024-03-05 CN disclosed
CN-112585181-B Curable resin composition and cured product 三键有限公司 2024-01-30 CN disclosed
CN-1466598-A Plastic lens composition, plastic lens and method for producing the plastic lens �Ѻ͵繤��ʽ���� 2004-01-07 CN disclosed
WO-2003078127-A1 COMPOSITE FOAMED POLYPROPYLENE RESIN MOLDING AND METHOD OF PRODUCING SAME JSP CORPORATION (JP) 2003-09-25 WO disclosed
US-20030107465-A1 Passive element component and substrate with built-in passive element KABUSHIKI KAISHA TOSHIBA (JP) 2003-06-12 US disclosed
WO-2003037971-A2 PROCESS OF PRODUCING EXPANDED POLYPROPYLENE RESIN BEADS JSP CORPORATION (JP) 2003-05-08 WO disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
WO-2002024794-A9 EXPANDED POLYPROPYLENE RESIN BEAD JSP CORP (JP) 2002-05-10 WO disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
US-5939465-A COMPRISING N-HETEROCYCLE COMPOUND, COMPOUND CONTAINING AT LEAST ONE ADDITION-POLYMERIZABLE, ETHYLENICALLY UNSATURATED BOND, AND COMPOUND WHICH GENERATES AN ACTIVE RADICAL UPON IRRADIATION OF LIGHT FUJI PHOTO FILM CO., LTD. (JP) 1999-08-17 US disclosed
US-5362595-A Blending high and low molecular weight polymers formed by bulk and solution polymerization; fixing at high speed and/or low temperature MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1994-11-08 US disclosed
EP-0193006-B1 METHOD FO PLASMA-INITIATED POLYMERIZATION TERUMO KABUSHIKI KAISHA trading as TERUMO CORPORATION (JP) 1989-11-02 EP disclosed