SCHEMBL18435064

SCHEMBL18435064

CCCCCCCCc1cc2cc3cc4cc5sc(SI)cc5cc4cc3cc2s1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL559602 0.87 PTGS2 (0.36) —
SCHEMBL2367919 0.87 PTGS2 (0.36) —
SCHEMBL12265773 0.87 PTGS2 (0.36) —
SCHEMBL13299960 0.83 PTGS2 (0.38) —
SCHEMBL2469032 0.83 PTGS2 (0.38) —
SCHEMBL2496088 0.83 PTGS2 (0.38) —
SCHEMBL17970826 0.81 PTGS2 (0.33) —
SCHEMBL18643477 0.80 PTGS2 (0.32) —
SCHEMBL17970676 0.77 GPR35 (0.32) —
SCHEMBL17970675 0.76 PTGS2 (0.33) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3125277-B1 SEMICONDUCTOR ELEMENT COMPRISING INSULATING LAYER-FORMING COMPOSITION FUJIFILM CORP (JP) 2020-06-03 — — EP disclosed
EP-3125277-A1 SEMICONDUCTOR ELEMENT AND INSULATING-LAYER-FORMING COMPOSITION FUJIFILM Corporation (JP) 2017-02-01 — — EP disclosed
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