SCHEMBL1845484

SCHEMBL1845484

CCO[Si](CCC(N)CCO)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4436682 0.89
SCHEMBL417868 0.86
SCHEMBL11096425 0.83 ALDH1A1 (0.33)
SCHEMBL1843724 0.82
Hydrochloric Acid SCHEMBL28942572 0.82 ALDH1A1 (0.32)
SCHEMBL3920242 0.82
SCHEMBL9167817 0.81
SCHEMBL638552 0.81 OPRM1 (0.39)
SCHEMBL28231469 0.80 OPRM1 (0.37)
SCHEMBL23302646 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113056584-B Fiber bundling agent, fiber material, molding material, and molded article DIC株式会社 2023-06-09 CN disclosed
CN-116194533-A Aqueous epoxy resin composition, fiber bundling agent, fiber bundle, molding material and molded article DIC株式会社 2023-05-30 CN disclosed
EP-3633099-B1 FIBER SIZING AGENT, FIBER MATERIAL, MOLDING MATERIAL AND MOLDING DAINIPPON INK & CHEMICALS (JP) 2023-05-10 EP disclosed
CN-110662865-B Fiber bundling agent, fiber material, molding material and molded article DIC株式会社 2022-06-24 CN disclosed
CN-114539501-A Fiber bundling agent, fiber bundle, molding material and molded article DIC株式会社 2022-05-27 CN disclosed
WO-2021261197-A1 FIBER BUNDLING AGENT, FIBER MATERIAL, FORMING MATERIAL, AND FORMED PRODUCT DIC株式会社 2021-12-30 WO disclosed
US-11168187-B2 Fiber sizing agent, fiber material, molding material and molding DIC CORPORATION (JP) 2021-11-09 US disclosed
CN-113056584-A Fiber bundling agent, fiber material, molding material and molded article DIC株式会社 2021-06-29 CN disclosed
WO-2020230481-A1 AQUEOUS EPOXY RESIN COMPOSITION, FIBER SIZING AGENT, FIBER MATERIAL, MOLDING MATERIAL AND COATING AGENT DIC株式会社 2020-11-19 WO disclosed
US-20200115514-A1 FIBER SIZING AGENT, FIBER MATERIAL, MOLDING MATERIAL AND MOLDING DIC CORPORATION (JP) 2020-04-16 US disclosed
CN-110662865-A Fiber bundling agent, fiber material, molding material and molded article DIC株式会社 2020-01-07 CN disclosed
EP-1777243-B1 AQUEOUS DISPERSIONS OF CATIONIC POLYURETHANE RESINS, INK-JET RECEIVING AGENTS CONTAINING THE SAME, AND INK-JET RECORDING MEDIA MADE BY USING THE AGENTS DAINIPPON INK & CHEMICALS (JP) 2011-05-18 EP disclosed
EP-1777243-A1 AQUEOUS DISPERSIONS OF CATIONIC POLYURETHANE RESINS, INK-JET RECEIVING AGENTS CONTAINING THE SAME, AND INK-JET RECORDING MEDIA MADE BY USING THE AGENTS DAINIPPON INK AND CHEMICALS, INC. (JP) 2007-04-25 EP disclosed
CN-1148414-C Cross-linked polyurethane resin composition for artificial leather and synthetic leather and artificial leather and synthetic leather produced therefrom 大日本油墨化学工业株式会社 2004-05-05 CN disclosed
CN-1176271-A Cross-linked polyurethane resin composition for artificial leather and synthetic leather and artificial leather and synthetic leather produced therefrom DAINIPPON INK & CHEMICALS (JP) 1998-03-18 CN disclosed