SCHEMBL1857360

SCHEMBL1857360

CC(CCc1ccc(Oc2ccc(N)cc2)cc1)c1ccc(Oc2ccc(N)cc2)cc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.47
TDP1 Q9NUW8 3/20 0.47
CYP3A4 P08684 1/20 0.47
TSHR P16473 1/20 0.47
TEAD4 Q15561 1/20 0.44
MAPT P10636 5/20 0.43
POLB P06746 1/20 0.43
GFER P55789 2/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
MAOA P21397 2/20 0.41
CYP19A1 P11511 1/20 0.41
NPC1 O15118 2/20 0.41
RAB9A P51151 2/20 0.41
HPGD P15428 1/20 0.41
MAPK1 P28482 1/20 0.41
MAOB P27338 1/20 0.40
MEN1 O00255 1/20 0.39
MITF O75030 1/20 0.39
GAA P10253 1/20 0.39
KMT2A Q03164 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7866770 0.85 MAOB (0.50) ALDH1A1CYP3A4MAPTPOLBGFER
SCHEMBL10411979 0.83 TDP1 (0.51) ALDH1A1TDP1CYP3A4TSHRSMN1; SMN2
SCHEMBL1856444 0.83 ESR1 (0.52) ALDH1A1TDP1CYP3A4TSHRTEAD4
SCHEMBL29263288 0.83 ESR1 (0.52) ALDH1A1TDP1CYP3A4TSHRTEAD4
SCHEMBL9141663 0.83 ALDH1A1 (0.50) ALDH1A1TDP1CYP3A4TSHRTEAD4
SCHEMBL6558453 0.79 ALDH1A1 (0.54) ALDH1A1TDP1CYP3A4TSHRTEAD4
SCHEMBL8447688 0.79 ALDH1A1 (0.54) ALDH1A1TDP1CYP3A4TSHRTEAD4
SCHEMBL12110749 0.78 ALDH1A1 (0.70) ALDH1A1TDP1CYP3A4TSHRTEAD4
SCHEMBL309841 0.78 ALDH1A1 (0.70) ALDH1A1TDP1CYP3A4TSHRTEAD4
SCHEMBL14302875 0.76 ALDH1A1 (0.50) ALDH1A1TDP1CYP3A4TSHRTEAD4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 187 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117241942-B Laminate body 东洋纺株式会社 2026-05-19 CN disclosed
US-12479194-B2 Laminate TOYOBO CO., LTD. (JP) 2025-11-25 US disclosed
US-12472732-B2 Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device TOYOBO CO., LTD. (JP) 2025-11-18 US disclosed
US-12391813-B2 Layered body including inorganic substrate and polyamic acid cured product TOYOBO CO., LTD. (JP) 2025-08-19 US disclosed
CN-115551713-B Laminate comprising transparent high heat resistant film 东洋纺株式会社 2025-03-21 CN disclosed
US-20250019508-A1 LAYERED BODY INCLUDING INORGANIC SUBSTRATE AND POLYAMIC ACID CURED PRODUCT TOYOBO CO., LTD. (JP) 2025-01-16 US disclosed
CN-115697575-B Resin film and method for producing same 东洋纺株式会社 2025-01-14 CN disclosed
WO-2024262187-A1 RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING RESIN FILM 東洋紡株式会社 2024-12-26 WO disclosed
US-12172409-B2 Laminate of inorganic substrate/polymer film layer with attached protective film, laminate stack, laminate storage method, and laminate transport method TOYOBO CO., LTD. (JP) 2024-12-24 US disclosed
CN-119072395-A Laminate body 东洋纺株式会社 2024-12-03 CN disclosed
EP-0636661-B1 Polyimide resin composition MITSUI TOATSU CHEMICALS (JP) 1997-11-05 EP disclosed
EP-0738746-A1 Liquid crystal polyamide-imide copolymer MITSUI TOATSU CHEMICALS, Inc. (JP) 1996-10-23 EP disclosed
US-5506291-A FORMED BY REACTING ONE OR MORE DIAMINES WITH PYROMLLITIC ACID OR BIPHENYLTETRACARBOXYLIC ACID/3,3',4,4'-/ AND ENDCAPPED BY ANHYDRIDE OR AROMATIC MONOAMINE; USED FOR ELECTRONICS, AIRCRAFT, AND ELECTRICAL APPLIANCES MITSUI TOATSU CHEMICALS, INC. (JP) 1996-04-09 US disclosed
US-5494996-A MELT PROCESSABILITY, HEAT AND AGING RESISTANCE MITSUI TOATSU CHEMICALS INC. (JP) 1996-02-27 US disclosed
EP-0661347-A1 Polyimide resin composition having excellent fatigue resistance and injection molded article of same MITSUI TOATSU CHEMICALS, Inc. (JP) 1995-07-05 EP disclosed
US-5406124-A Thermoplastic polyimides MITSUI TOATSU CHEMICALS, INC. (JP) 1995-04-11 US disclosed
EP-0636661-A1 Polyimide resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1995-02-01 EP disclosed
EP-0605112-A2 Insulating adhesive tape, and lead frame and semiconductor device employing the tape MITSUI TOATSU CHEMICALS, Inc. (JP) 1994-07-06 EP disclosed
US-5321096-A Good processability and heat stability MITSUI TOATSU CHEMICAL, INCORPORATED (JP) 1994-06-14 US disclosed
EP-0564299-A2 Polyimide composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-10-06 EP disclosed