SCHEMBL1856444

SCHEMBL1856444

CC(Cc1ccc(Oc2ccc(N)cc2)cc1)c1ccc(Oc2ccc(N)cc2)cc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.52
ESR2 Q92731 1/20 0.52
ALDH1A1 P00352 6/20 0.50
TDP1 Q9NUW8 3/20 0.50
CYP3A4 P08684 1/20 0.50
TSHR P16473 1/20 0.50
TEAD4 Q15561 1/20 0.47
MAPT P10636 5/20 0.46
POLB P06746 1/20 0.46
SMN1; SMN2 Q16637 2/20 0.44
MAOA P21397 2/20 0.44
CYP1A2 P05177 1/20 0.43
CYP2D6 P10635 1/20 0.43
CYP2C19 P33261 1/20 0.43
NPC1 O15118 3/20 0.43
RAB9A P51151 3/20 0.43
HPGD P15428 1/20 0.43
MAPK1 P28482 1/20 0.43
MAOB P27338 1/20 0.42
SLC6A4 P31645 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29263288 1.00 ESR1 (0.52) ESR1ESR2ALDH1A1TDP1CYP3A4
SCHEMBL3922242 0.92 MAOA (0.53) ESR1ESR2ALDH1A1TDP1CYP3A4
SCHEMBL3922244 0.92 MAOA (0.53) ESR1ESR2ALDH1A1TDP1CYP3A4
SCHEMBL311572 0.89 ESR1 (0.63) ESR1ESR2ALDH1A1TDP1CYP3A4
SCHEMBL1100456 0.89 ESR1 (0.63) ESR1ESR2ALDH1A1TDP1CYP3A4
SCHEMBL5949977 0.89 ESR1 (0.63) ESR1ESR2ALDH1A1TDP1CYP3A4
SCHEMBL29436304 0.85 MAOB (0.54) ESR1ESR2ALDH1A1CYP3A4MAPT
SCHEMBL7865335 0.85 MAOB (0.54) ESR1ESR2ALDH1A1CYP3A4MAPT
SCHEMBL8611155 0.84 ALDH1A1 (0.41) ESR1ESR2ALDH1A1TDP1CYP3A4
SCHEMBL15070045 0.84 ESR1 (0.53) ESR1ESR2ALDH1A1TDP1TEAD4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 212 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117241942-B Laminate body 东洋纺株式会社 2026-05-19 CN disclosed
US-12479194-B2 Laminate TOYOBO CO., LTD. (JP) 2025-11-25 US disclosed
US-12472732-B2 Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device TOYOBO CO., LTD. (JP) 2025-11-18 US disclosed
US-12391813-B2 Layered body including inorganic substrate and polyamic acid cured product TOYOBO CO., LTD. (JP) 2025-08-19 US disclosed
CN-115551713-B Laminate comprising transparent high heat resistant film 东洋纺株式会社 2025-03-21 CN disclosed
WO-2025047667-A1 SHEET MATERIAL AND METHOD FOR PRODUCING SHEET MATERIAL 東洋紡株式会社 2025-03-06 WO disclosed
US-20250019508-A1 LAYERED BODY INCLUDING INORGANIC SUBSTRATE AND POLYAMIC ACID CURED PRODUCT TOYOBO CO., LTD. (JP) 2025-01-16 US disclosed
CN-115697575-B Resin film and method for producing same 东洋纺株式会社 2025-01-14 CN disclosed
WO-2024262187-A1 RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING RESIN FILM 東洋紡株式会社 2024-12-26 WO disclosed
US-12172409-B2 Laminate of inorganic substrate/polymer film layer with attached protective film, laminate stack, laminate storage method, and laminate transport method TOYOBO CO., LTD. (JP) 2024-12-24 US disclosed
US-5494996-A MELT PROCESSABILITY, HEAT AND AGING RESISTANCE MITSUI TOATSU CHEMICALS INC. (JP) 1996-02-27 US disclosed
EP-0661347-A1 Polyimide resin composition having excellent fatigue resistance and injection molded article of same MITSUI TOATSU CHEMICALS, Inc. (JP) 1995-07-05 EP disclosed
US-5406124-A Thermoplastic polyimides MITSUI TOATSU CHEMICALS, INC. (JP) 1995-04-11 US disclosed
EP-0636661-A1 Polyimide resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1995-02-01 EP disclosed
US-5354890-A Aromatic diamine intermediates useful in the preparation of polyimides MITSUI TOATSU CHEMICALS, INC. (JP) 1994-10-11 US disclosed
EP-0605112-A2 Insulating adhesive tape, and lead frame and semiconductor device employing the tape MITSUI TOATSU CHEMICALS, Inc. (JP) 1994-07-06 EP disclosed
US-5321096-A Good processability and heat stability MITSUI TOATSU CHEMICAL, INCORPORATED (JP) 1994-06-14 US disclosed
US-5260388-A Reacting aromatic diamine with tetracarboxylic anhydride in presence of aromatic dicarboxylic anhydride or monoamine, imidizing; low dielectric characteristics; electronics MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1993-11-09 US disclosed
EP-0564299-A2 Polyimide composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-10-06 EP disclosed
EP-0518543-A2 Polyimide and process for the preparation thereof MITSUI TOATSU CHEMICALS, Inc. (JP) 1992-12-16 EP disclosed