⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL249947 | 0.96 | LMNA (0.50) | — | |
| SCHEMBL827 | 0.96 | — | — | |
| SCHEMBL4306610 | 0.93 | — | — | |
| SCHEMBL8780216 | 0.93 | LMNA (0.47) | — | |
| Water SCHEMBL2725358 | 0.93 | — | — | |
| SCHEMBL11516591 | 0.93 | LMNA (0.47) | — | |
| SCHEMBL1177405 | 0.93 | — | — | |
| SCHEMBL1304651 | 0.93 | — | — | |
| Bromide SCHEMBL20595015 | 0.93 | — | — | |
| SCHEMBL1138826 | 0.93 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250327202-A1 | METHOD OF INHIBITING TARNISH FORMATION AND CORROSION | DUPONT ELECTRONIC MAT INTERNATIONAL LLC (US) | 2025-10-23 | — | — | US | disclosed |
| US-20230304180-A1 | METHOD OF INHIBITING TARNISH FORMATION AND CORROSION | DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC | 2023-09-28 | — | — | US | disclosed |
| EP-4249646-A1 | METHOD OF INHIBITING TARNISH FORMATION AND CORROSION | Rohm and Haas Electronic Materials LLC (US) | 2023-09-27 | — | — | EP | disclosed |
| EP-4098778-A1 | ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS | Rohm and Haas Electronic Materials LLC (US) | 2022-12-07 | — | — | EP | disclosed |
| US-11434577-B2 | Acid aqueous binary silver-bismuth alloy electroplating compositions and methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2022-09-06 | — | — | US | disclosed |
| EP-3816326-B1 | ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS | ROHM & HAAS ELECT MAT (US) | 2022-06-29 | — | — | EP | disclosed |
| EP-3835459-A1 | ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS | Rohm and Haas Electronic Materials LLC (US) | 2021-06-16 | — | — | EP | disclosed |
| US-20210172082-A1 | ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS | DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC | 2021-06-10 | — | — | US | disclosed |
| EP-3816326-A1 | ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS | Rohm and Haas Electronic Materials LLC (US) | 2021-05-05 | — | — | EP | disclosed |
| US-20210115582-A1 | ACID AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2021-04-22 | — | — | US | disclosed |
| CN-106521577-B | Bismuth electroplating bath and the method being plated on bismuth on substrate | 罗门哈斯电子材料有限责任公司 | 2019-02-26 | — | — | CN | disclosed |
| EP-3150743-B1 | BISMUTH ELECTROPLATING BATHS AND METHODS OF ELECTROPLATING BISMUTH ON A SUBSTRATE | ROHM & HAAS ELECT MAT (US) | 2018-08-22 | — | — | EP | disclosed |
| US-9850588-B2 | Bismuth electroplating baths and methods of electroplating bismuth on a substrate | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2017-12-26 | — | — | US | disclosed |
| EP-3150743-A2 | BISMUTH ELECTROPLATING BATHS AND METHODS OF ELECTROPLATING BISMUTH ON A SUBSTRATE | Rohm and Haas Electronic Materials LLC (US) | 2017-04-05 | — | — | EP | disclosed |
| US-20170067174-A1 | BISMUTH ELECTROPLATING BATHS AND METHODS OF ELECTROPLATING BISMUTH ON A SUBSTRATE | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2017-03-09 | — | — | US | disclosed |