SCHEMBL18601289

SCHEMBL18601289

c1coc(CNCC2CO2)c1

nearest known ligand 0.52

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.52
RECQL P46063 1/20 0.52
CHRM2 P08172 1/20 0.51
MEN1 O00255 1/20 0.47
KMT2A Q03164 1/20 0.47
USP2 O75604 1/20 0.47
POLB P06746 2/20 0.46
ALDH1A1 P00352 2/20 0.46
LMNA P02545 1/20 0.46
MAPT P10636 1/20 0.42
HPGD P15428 1/20 0.42
CYP1A2 P05177 1/20 0.42
CYP2D6 P10635 1/20 0.42
ATM Q13315 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL843371 0.78 CHRM2 (0.69) TSHRCHRM2MEN1KMT2AUSP2
Methane SCHEMBL28948442 0.76 CHRM2 (0.67) TSHRCHRM2MEN1KMT2AUSP2
SCHEMBL10877505 0.75
SCHEMBL1642902 0.74 CHRM2 (0.77) TSHRCHRM2MEN1KMT2AUSP2
SCHEMBL2265474 0.73 EP300 (0.48) TSHRRECQLCHRM2MEN1KMT2A
SCHEMBL4506591 0.72
SCHEMBL19125641 0.72 DRD2 (0.56) MEN1KMT2AALDH1A1
SCHEMBL2592594 0.72 DRD2 (0.56) MEN1KMT2AALDH1A1
SCHEMBL13278276 0.71 CHRM2 (0.85) TSHRCHRM2MEN1KMT2AUSP2
SCHEMBL14040527 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119286363-A Anticorrosive paint, preparation method thereof, anticorrosive coating and application 南方电网科学研究院有限责任公司 2025-01-10 CN claimed
CN-118165683-A Self-repairable array ACF material and preparation method thereof 宁波连森电子材料有限公司 2024-06-11 CN claimed
CN-114479353-B Topological interlocking liquid crystal epoxy heat-conducting resin and preparation method and application thereof 中山大学 2023-03-31 CN claimed
CN-114479353-A Topological interlocking liquid crystal epoxy heat-conducting resin and preparation method and application thereof 中山大学 2022-05-13 CN claimed
US-10633755-B2 Copper plating bath composition and method for deposition of copper ATOTECH DEUTSCHLAND GMBH (DE) 2020-04-28 US claimed
US-20180237932-A1 COPPER PLATING BATH COMPOSITION AND METHOD FOR DEPOSITION OF COPPER ATOTECH USA, LLC 2018-08-23 US claimed
EP-3141633-B1 COPPER PLATING BATH COMPOSITION ATOTECH DEUTSCHLAND GMBH (DE) 2018-05-02 EP claimed
EP-3141633-A1 COPPER PLATING BATH COMPOSITION ATOTECH Deutschland GmbH (DE) 2017-03-15 EP claimed
CN-119286363-A Anticorrosive paint, preparation method thereof, anticorrosive coating and application 南方电网科学研究院有限责任公司 2025-01-10 CN disclosed
CN-118359753-A Self-repairing polymer resin material and self-repairing ink containing same 株式会社日立产机系统 2024-07-19 CN disclosed
CN-118165683-A Self-repairable array ACF material and preparation method thereof 宁波连森电子材料有限公司 2024-06-11 CN disclosed
CN-114479353-B Topological interlocking liquid crystal epoxy heat-conducting resin and preparation method and application thereof 中山大学 2023-03-31 CN disclosed
CN-114479353-A Topological interlocking liquid crystal epoxy heat-conducting resin and preparation method and application thereof 中山大学 2022-05-13 CN disclosed
US-10633755-B2 Copper plating bath composition and method for deposition of copper ATOTECH DEUTSCHLAND GMBH (DE) 2020-04-28 US disclosed
US-20180237932-A1 COPPER PLATING BATH COMPOSITION AND METHOD FOR DEPOSITION OF COPPER ATOTECH USA, LLC 2018-08-23 US disclosed
EP-3141633-B1 COPPER PLATING BATH COMPOSITION ATOTECH DEUTSCHLAND GMBH (DE) 2018-05-02 EP disclosed
EP-3141633-A1 COPPER PLATING BATH COMPOSITION ATOTECH Deutschland GmbH (DE) 2017-03-15 EP disclosed