Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KMT2A | Q03164 | 4/20 | 0.49 |
| ▸ | ANPEP | P15144 | 1/20 | 0.49 |
| ▸ | HPGD | P15428 | 3/20 | 0.47 |
| ▸ | USP2 | O75604 | 1/20 | 0.47 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.47 |
| ▸ | PKM | P14618 | 1/20 | 0.46 |
| ▸ | TP53 | P04637 | 1/20 | 0.46 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.45 |
| ▸ | LMNA | P02545 | 1/20 | 0.45 |
| ▸ | MEN1 | O00255 | 1/20 | 0.44 |
| ▸ | ATM | Q13315 | 1/20 | 0.44 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL611743 | 0.93 | KMT2A (0.53) | KMT2AANPEPHPGDUSP2SMN1; SMN2 | |
| SCHEMBL17376511 | 0.84 | HPGD (0.54) | KMT2AANPEPHPGDUSP2SMN1; SMN2 | |
| SCHEMBL509597 | 0.80 | — | — | |
| SCHEMBL2448784 | 0.80 | — | — | |
| SCHEMBL6467984 | 0.80 | — | — | |
| SCHEMBL5626593 | 0.80 | — | — | |
| SCHEMBL8247969 | 0.80 | — | — | |
| SCHEMBL15671149 | 0.80 | USP2 (0.50) | KMT2AANPEPHPGDUSP2SMN1; SMN2 | |
| SCHEMBL17480336 | 0.80 | — | — | |
| SCHEMBL131519 | 0.80 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10633755-B2 | Copper plating bath composition and method for deposition of copper | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-04-28 | — | — | US | claimed |
| US-20180237932-A1 | COPPER PLATING BATH COMPOSITION AND METHOD FOR DEPOSITION OF COPPER | ATOTECH USA, LLC | 2018-08-23 | — | — | US | claimed |
| EP-3141633-B1 | COPPER PLATING BATH COMPOSITION | ATOTECH DEUTSCHLAND GMBH (DE) | 2018-05-02 | — | — | EP | claimed |
| EP-3141633-A1 | COPPER PLATING BATH COMPOSITION | ATOTECH Deutschland GmbH (DE) | 2017-03-15 | — | — | EP | claimed |
| US-10633755-B2 | Copper plating bath composition and method for deposition of copper | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-04-28 | — | — | US | disclosed |
| US-20180237932-A1 | COPPER PLATING BATH COMPOSITION AND METHOD FOR DEPOSITION OF COPPER | ATOTECH USA, LLC | 2018-08-23 | — | — | US | disclosed |
| EP-3141633-B1 | COPPER PLATING BATH COMPOSITION | ATOTECH DEUTSCHLAND GMBH (DE) | 2018-05-02 | — | — | EP | disclosed |
| EP-3141633-A1 | COPPER PLATING BATH COMPOSITION | ATOTECH Deutschland GmbH (DE) | 2017-03-15 | — | — | EP | disclosed |