⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL24994362 | 0.81 | CYP2C9 (0.30) | — | |
| SCHEMBL24526587 | 0.79 | DPP4 (0.32) | — | |
| SCHEMBL20691730 | 0.77 | — | — | |
| SCHEMBL24720156 | 0.74 | — | — | |
| SCHEMBL23974122 | 0.72 | ALDH1A1 (0.33) | — | |
| SCHEMBL24994360 | 0.72 | HMGCR (0.37) | — | |
| SCHEMBL19134570 | 0.70 | — | — | |
| SCHEMBL19125903 | 0.65 | DPP4 (0.33) | — | |
| SCHEMBL25810854 | 0.65 | ALDH1A1 (0.46) | — | |
| SCHEMBL18560732 | 0.62 | SLC1A3 (0.35) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20210286264-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-16 | — | — | US | disclosed |
| US-10962884-B2 | Treatment liquid and pattern forming method | FUJIFILM CORPORATION (JP) | 2021-03-30 | — | — | US | disclosed |
| US-10423068-B2 | Active-light-sensitive or radiation-sensitive resin composition, active-light-sensitive or radiation-sensitive film, pattern forming method, and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2019-09-24 | — | — | US | disclosed |
| US-20180217503-A1 | TREATMENT LIQUID AND PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2018-08-02 | — | — | US | disclosed |
| US-20170242338-A1 | ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2017-08-24 | — | — | US | disclosed |
| US-9601706-B2 | Resin composition for forming protective film, protective film, pattern forming method, method for manufacturing electronic device, and electronic device | FUJIFILM CORPORATION (JP) | 2017-03-21 | — | — | US | disclosed |