Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CHRNA7 | P36544 | 2/20 | 0.51 |
| ▸ | CYP2C9 | P11712 | 3/20 | 0.45 |
| ▸ | CYP2C19 | P33261 | 3/20 | 0.45 |
| ▸ | HPGD | P15428 | 2/20 | 0.45 |
| ▸ | CALM1 | P0DP23 | 1/20 | 0.44 |
| ▸ | LMNA | P02545 | 3/20 | 0.44 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.44 |
| ▸ | HTR2A | P28223 | 1/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.44 |
| ▸ | ATM | Q13315 | 1/20 | 0.44 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.44 |
| ▸ | SLC6A4 | P31645 | 3/20 | 0.43 |
| ▸ | SLC6A2 | P23975 | 2/20 | 0.43 |
| ▸ | SLC6A3 | Q01959 | 2/20 | 0.43 |
| ▸ | MEN1 | O00255 | 1/20 | 0.42 |
| ▸ | POLB | P06746 | 1/20 | 0.42 |
| ▸ | PRNP | P04156 | 1/20 | 0.42 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.42 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL352618 | 0.89 | CALM1 (0.50) | CHRNA7HPGDCALM1LMNASMN1; SMN2 | |
| SCHEMBL28981222 | 0.87 | KEAP1 (0.55) | CHRNA7CYP2C9CYP2C19HPGDLMNA | |
| SCHEMBL28456099 | 0.83 | HPGD (0.43) | CHRNA7CYP2C9CYP2C19HPGDLMNA | |
| SCHEMBL16749624 | 0.83 | CYP2C9 (0.43) | CHRNA7CYP2C9CYP2C19HPGDLMNA | |
| SCHEMBL14712745 | 0.83 | SLC6A4 (0.51) | CHRNA7CYP2C9CYP2C19HPGDLMNA | |
| SCHEMBL14712740 | 0.83 | MEN1 (0.67) | LMNAKMT2AALDH1A1SLC6A4SLC6A2 | |
| SCHEMBL18758016 | 0.82 | CHRNA7 (0.47) | CHRNA7CYP2C9CYP2C19HPGDLMNA | |
| SCHEMBL3796748 | 0.82 | HPGD (0.48) | CHRNA7HPGDCALM1SMN1; SMN2HTR2A | |
| SCHEMBL16749623 | 0.81 | MEN1 (0.49) | CYP2C9CYP2C19HPGDLMNASMN1; SMN2 | |
| SCHEMBL946829 | 0.80 | APOBEC3G (0.54) | HPGDCALM1SMN1; SMN2HTR2AKMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 251 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220177742-A1 | REPEELABLE ADHESIVE INCLUDING PHOTOCURABLE ADHESIVE AND HEAT FOAMING AGENT AND REPEELABLE ADHESIVE TAPE INCLUDING THE SAME | Truss Co., Ltd (KR) | 2022-06-09 | — | — | US | claimed |
| US-8183303-B2 | Adhesive composition and adhesive film made therefrom | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-05-22 | — | — | US | claimed |
| US-20100197821-A1 | ADHESIVE COMPOSITION AND ADHESIVE FILM MADE THEREFROM | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-08-05 | — | — | US | claimed |
| CN-118231319-A | Third laminate, fourth laminate, method for manufacturing semiconductor device with back surface protective film, and third laminate | 琳得科株式会社 | 2024-06-21 | — | — | CN | disclosed |
| CN-118139940-A | Piece for workpiece processing and method for manufacturing processed workpiece | 琳得科株式会社 | 2024-06-04 | — | — | CN | disclosed |
| CN-113519092-B | Electromagnetic wave absorbing film and electromagnetic wave absorbing sheet | 琳得科株式会社 | 2024-06-04 | — | — | CN | disclosed |
| CN-118103936-A | Contact sensor and wiring sheet | 琳得科株式会社 | 2024-05-28 | — | — | CN | disclosed |
| CN-118043415-A | Piece for workpiece processing and method for manufacturing processed workpiece | 琳得科株式会社 | 2024-05-14 | — | — | CN | disclosed |
| CN-118019818-A | Piece for workpiece processing and method for manufacturing processed workpiece | 琳得科株式会社 | 2024-05-10 | — | — | CN | disclosed |
| CN-117858800-A | Release film for molding resin sheet | 东洋纺株式会社 | 2024-04-09 | — | — | CN | disclosed |
| US-20240018399-A1 | RADIATION CURABLE (METH) ACRYLIC ADHESIVE COMPOSITION | HENKEL AG & CO. KGAA (DE) | 2024-01-18 | — | — | US | disclosed |
| US-20020019454-A1 | Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet- curable pressure sensitive adhesive sheet | LINTEC CORPORATION | 2002-02-14 | — | — | US | disclosed |
| EP-1170345-A2 | Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheet | LINTEC Corporation (JP) | 2002-01-09 | — | — | EP | disclosed |
| US-6297076-B1 | FORMING RADIATION CURABLE ADHESIVE LAYER ON SUBSTRATE FILM, JOINING ACRYLIC ADHESIVE COPOLYMER, RADIATION POLYMERIZABLE COMPOUND, CUTTING, RADIATION, REMOVAL AND PACKAGING | LINTEC CORPORATION (JP) | 2001-10-02 | — | — | US | disclosed |
| US-20010023264-A1 | UV-curable pressure-sensitive adhesive composition and its pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2001-09-20 | — | — | US | disclosed |
| EP-1128426-A2 | Uv-curable pressure-sensitive adhesive composition and its pressure-sensitive adhesive sheet | NITTO DENKO CORPORATION (JP) | 2001-08-29 | — | — | EP | disclosed |
| EP-0775715-B1 | Adhesive composition and adhesive sheet | LINTEC CORP (JP) | 2001-02-14 | — | — | EP | disclosed |
| EP-0622833-B1 | Adhesive sheet for wafer and process for preparing semiconductor apparatus using the same | TEXAS INSTRUMENTS INC (US) | 1999-03-31 | — | — | EP | disclosed |
| EP-0775715-A2 | Adhesive composition and adhesive sheet | LINTEC Corporation (JP) | 1997-05-28 | — | — | EP | disclosed |
| EP-0622833-A1 | Adhesive sheet for wafer and process for preparing semiconductor apparatus using the same | TEXAS INSTRUMENTS INCORPORATED (US) | 1994-11-02 | — | — | EP | disclosed |