SCHEMBL18675596

SCHEMBL18675596

CCC(CC)(OC(=O)C1CC2CC1C(C)C2C)C12CC3CC(CC(C3)C1)C2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL112450 0.83 MEN1 (0.31)
SCHEMBL2682034 0.78
SCHEMBL15268355 0.76
SCHEMBL15268354 0.76
SCHEMBL2681913 0.76
SCHEMBL110272 0.76
SCHEMBL15268386 0.76
SCHEMBL2681394 0.74 NAAA (0.37)
SCHEMBL15268324 0.73 MAPK1 (0.35)
SCHEMBL11923110 0.73 ALDH1A1 (0.36)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180002561-A1 RESIN COMPOSITION FOR UNDERLAYER FILM FORMATION, IMPRINT FORMING KIT, LAMINATE, PATTERN FORMING METHOD, AND METHOD FOR PRODUCING DEVICE FUJIFILM CORPORATION (JP) 2018-01-04 US disclosed
US-20170158905-A1 RESIN COMPOSITION FOR UNDERLAYER FILM FORMATION, LAYERED PRODUCT, METHOD FOR FORMING PATTERN, IMPRINT FORMING KIT, AND PROCESS FOR PRODUCING DEVICE FUJIFILM CORPORATION (JP) 2017-06-08 US disclosed
US-20170146907-A1 RESIN COMPOSITION FOR UNDERLAYER FILM FORMATION, LAYERED PRODUCT, METHOD FOR FORMING PATTERN, IMPRINT FORMING KIT AND PROCESS FOR PRODUCING DEVICE FUJIFILM CORPORATION (JP) 2017-05-25 US disclosed
US-20170088743-A1 RESIN COMPOSITION FOR UNDERLAYER FILM FORMATION, LAYERED PRODUCT, METHOD FOR FORMING PATTERN, AND PROCESS FOR PRODUCING DEVICE FUJIFILM CORPORATION (JP) 2017-03-30 US disclosed