SCHEMBL1884332

SCHEMBL1884332

N#C[Au].[Au]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11586584 0.94
SCHEMBL123096 0.93
SCHEMBL29612650 0.86
SCHEMBL29376057 0.86
Potassium SCHEMBL29384652 0.86
SCHEMBL8059510 0.86
SCHEMBL10783305 0.86
SCHEMBL4367777 0.86
Ammonia Solution, Strong SCHEMBL829064 0.86
Ammonia Solution, Strong SCHEMBL29827529 0.86

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116837527-A Jacquard jacquard device and installation method thereof 泉州杰嘉智能科技有限公司 2023-10-03 CN disclosed
US-8308967-B2 Wet etched insulator and electronic circuit component DAI NIPPON PRINTING CO., LTD. (JP) 2012-11-13 US disclosed
US-20110108519-A1 WET ETCHED INSULATOR AND ELECTRONIC CIRCUIT COMPONENT DAI NIPPON PRINTING CO., LTD. (JP) 2011-05-12 US disclosed
US-7226806-B2 Wet etched insulator and electronic circuit component DAI NIPPON PRINTING CO., LTD. (JP) 2007-06-05 US disclosed
US-20070120229-A1 Wet etched insulator and electronic circuit component DAI NIPPON PRINTING CO., LTD. (JP) 2007-05-31 US disclosed
US-20030085451-A1 Wet etched insulator and electronic circuit component DAI NIPPON PRINTING CO., LTD. (JP) 2003-05-08 US disclosed