⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL123096 | 0.93 | — | — | |
| Ammonia Solution, Strong SCHEMBL29827529 | 0.86 | — | — | |
| SCHEMBL29376057 | 0.86 | — | — | |
| Potassium SCHEMBL29384652 | 0.86 | — | — | |
| SCHEMBL1884332 | 0.86 | — | — | |
| SCHEMBL8059510 | 0.86 | — | — | |
| Ammonia Solution, Strong SCHEMBL829064 | 0.86 | — | — | |
| SCHEMBL3859879 | 0.86 | — | — | |
| SCHEMBL4367777 | 0.86 | — | — | |
| SCHEMBL10783305 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4632115-A1 | GOLD ELECTROPLATING SOLUTION AND USE THEREOF | Huawei Technologies Co., Ltd. (CN) | 2025-10-15 | — | — | EP | claimed |
| US-20240218548-A1 | ELECTROPLATING GOLD PLATING SOLUTION AND USE THEREOF | HUAWEI TECHNOLOGIES CO., LTD. (CN) | 2024-07-04 | — | — | US | claimed |
| EP-4394090-A1 | ELECTROPLATING GOLD PLATING SOLUTION AND USE THEREOF | Huawei Technologies Co., Ltd. (CN) | 2024-07-03 | — | — | EP | claimed |
| CN-114836795-B | Electroforming solution for gold cladding and preparation method and application thereof | 深圳市铭轩珠宝首饰有限公司 | 2023-12-19 | — | — | CN | claimed |
| CN-115928161-A | Gold electroplating solution and application thereof, gold bump and preparation method thereof, electronic component and electronic equipment | 华为技术有限公司 | 2023-04-07 | — | — | CN | claimed |
| CN-115710701-A | Chemical gold plating solution and application | 广东东硕科技有限公司 | 2023-02-24 | — | — | CN | claimed |
| EP-4632115-A1 | GOLD ELECTROPLATING SOLUTION AND USE THEREOF | Huawei Technologies Co., Ltd. (CN) | 2025-10-15 | — | — | EP | disclosed |
| US-20240218548-A1 | ELECTROPLATING GOLD PLATING SOLUTION AND USE THEREOF | HUAWEI TECHNOLOGIES CO., LTD. (CN) | 2024-07-04 | — | — | US | disclosed |
| EP-4394090-A1 | ELECTROPLATING GOLD PLATING SOLUTION AND USE THEREOF | Huawei Technologies Co., Ltd. (CN) | 2024-07-03 | — | — | EP | disclosed |
| CN-114836794-B | Gold-copper alloy electroforming process and application thereof | 深圳市铭轩珠宝首饰有限公司 | 2024-01-30 | — | — | CN | disclosed |
| CN-114836795-B | Electroforming solution for gold cladding and preparation method and application thereof | 深圳市铭轩珠宝首饰有限公司 | 2023-12-19 | — | — | CN | disclosed |
| CN-115710701-A | Chemical gold plating solution and application | 广东东硕科技有限公司 | 2023-02-24 | — | — | CN | disclosed |
| CN-114875456-A | Copper-gold composite gold-coating method and application thereof | 深圳市铭轩珠宝首饰有限公司 | 2022-08-09 | — | — | CN | disclosed |
| CN-114836794-A | Gold-copper alloy electroforming process and application thereof | 深圳市铭轩珠宝首饰有限公司 | 2022-08-02 | — | — | CN | disclosed |
| CN-114836795-A | Electroforming solution for coating gold and preparation method and application thereof | 深圳市铭轩珠宝首饰有限公司 | 2022-08-02 | — | — | CN | disclosed |
| CN-114525556-A | Tungsten-containing alloy coated with gold casting layer and preparation method thereof | 王文荣 | 2022-05-24 | — | — | CN | disclosed |