⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL123096 | 0.93 | — | — | |
| SCHEMBL29612650 | 0.86 | — | — | |
| SCHEMBL29376057 | 0.86 | — | — | |
| Ammonia Solution, Strong SCHEMBL29827529 | 0.86 | — | — | |
| SCHEMBL4367777 | 0.86 | — | — | |
| Potassium SCHEMBL29384652 | 0.86 | — | — | |
| SCHEMBL1884332 | 0.86 | — | — | |
| SCHEMBL10783305 | 0.86 | — | — | |
| SCHEMBL8059510 | 0.86 | — | — | |
| SCHEMBL27898480 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 122 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115710701-B | Electroless gold plating solution and application | 广东东硕科技有限公司 | 2024-12-10 | — | — | CN | claimed |
| CN-115928161-B | Gold electroplating solution and application thereof, gold bump, preparation method of gold bump, electronic component and electronic equipment | 华为技术有限公司 | 2024-08-27 | — | — | CN | claimed |
| WO-2024140976-A1 | GOLD ELECTROPLATING SOLUTION AND USE THEREOF | 华为技术有限公司 | 2024-07-04 | — | — | WO | claimed |
| CN-116240597-B | Electroplating solution and application thereof | 华为技术有限公司 | 2024-03-26 | — | — | CN | claimed |
| EP-3023520-B1 | ENVIRONMENTALLY FRIENDLY GOLD ELECTROPLATING COMPOSITIONS AND CORRESPONDING METHOD | ROHM & HAAS ELECT MAT (US) | 2019-01-30 | — | — | EP | claimed |
| US-20160145756-A1 | ENVIRONMENTALLY FRIENDLY GOLD ELECTROPLATING COMPOSITIONS AND METHODS | ROHM AND HAAS ELECRONIC MATERIALS LLC | 2016-05-26 | — | — | US | claimed |
| EP-3023520-A1 | ENVIRONMENTALLY FRIENDLY GOLD ELECTROPLATING COMPOSITIONS AND METHODS | Rohm and Haas Electronic Materials LLC (US) | 2016-05-25 | — | — | EP | claimed |
| US-6383269-B1 | AQUEOUS ELECTROLYTES FOR IMMERSION PLATING | SHIPLEY COMPANY, L.L.C. | 2002-05-07 | — | — | US | claimed |
| EP-1026285-A2 | Electroless gold plating solution and process | Shipley Company LLC (US) | 2000-08-09 | — | — | EP | claimed |
| EP-0384679-B1 | Electrolytic deposition of gold-containing alloys | ENGELHARD CORP (US) | 1994-08-17 | — | — | EP | claimed |
| EP-0384227-B1 | Bath for the galvanic deposition of pure gold coatings | DEGUSSA (DE) | 1994-01-19 | — | — | EP | claimed |
| US-5055173-A | Gold cyanide derivatives, bismuth compounds and phosphonic acid compounds | DEGUSSA AKTIENGESELLSCHAFT (DE) | 1991-10-08 | — | — | US | claimed |
| US-4962004-A | USING PLATING SOLUTION CONTAINING ONLY AMMONIUM CATIONS AND THOSE OF THE METAL BEING PLATED | DIGITAL EQUIPMENT CORPORATION (US) | 1990-10-09 | — | — | US | claimed |
| EP-0384679-A1 | Electrolytic deposition of gold-containing alloys | ENGELHARD CORPORATION (US) | 1990-08-29 | — | — | EP | claimed |
| US-4615774-A | USING BATH CONTAINING OXALIC AND FORMIC ACID | OMI INTERNATIONAL CORPORATION (US) | 1986-10-07 | — | — | US | claimed |
| US-4372830-A | Recovery of gold in gold plating processes | BELL TELEPHONE LABORATORIES, INCORPORATED (US) | 1983-02-08 | — | — | US | claimed |
| JP-4028894-A | — | — | None | — | — | JP | disclosed |
| JP-5025678-A | — | — | None | — | — | JP | disclosed |
| US-4372830-A | Recovery of gold in gold plating processes | BELL TELEPHONE LABORATORIES, INCORPORATED (US) | 1983-02-08 | — | — | US | disclosed |
| US-4075065-A | ALKALI GOLD CYANIDE, LEWIS ACID, POLYFUNCTIONAL ALIPHATIC ACID, METALLIC HARDENER | HANDY & HARMAN (US) | 1978-02-21 | — | — | US | disclosed |