SCHEMBL18855324

SCHEMBL18855324

Cc1c(C)c(-c2cc(-c3c(C)c(C)c(O)c(I)c3C)cc(-c3c(C)c(C)c(O)c(I)c3C)c2)c(C)c(I)c1O

nearest known ligand 0.37

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
▸ SENP1 Q9P0U3 1/20 0.37
▸ TTR P02766 1/20 0.33
▸ CA1 P00915 1/20 0.33
▸ CA2 P00918 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25575178 0.80 SENP1 (0.42) SENP1CA1CA2
SCHEMBL11340378 0.72 TTR (0.32) TTR
SCHEMBL8434664 0.71 TTR (0.35) TTR
SCHEMBL19011885 0.69 TTR (0.30) TTR
SCHEMBL19012057 0.69 TTR (0.30) TTR
SCHEMBL19920732 0.68 TTR (0.33) TTR
SCHEMBL7929083 0.67 CA1 (0.54) SENP1TTRCA1CA2
SCHEMBL25574478 0.65 ERN1 (0.31) SENP1
SCHEMBL5587538 0.64 TTR (0.30) TTR
SCHEMBL18855339 0.64 TTR (0.58) TTRCA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9651864-B2 Negative resist composition, method for producing relief pattern using the same, and electronic component using the same DAI NIPPON PRINTING CO., LTD. (JP) 2017-05-16 — — US disclosed
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