SCHEMBL1885852

SCHEMBL1885852

C=C(C)C(=O)CCOc1ccc(C(=O)c2ccccc2)cc1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 2/20 0.60
PPARA Q07869 3/20 0.60
ELANE P08246 2/20 0.57
L3MBTL1 Q9Y468 4/20 0.56
LMNA P02545 3/20 0.56
MAPT P10636 3/20 0.56
MAPK1 P28482 1/20 0.55
HTT P42858 3/20 0.54
ALDH1A1 P00352 2/20 0.54
SMN1; SMN2 Q16637 2/20 0.54
LTA4H P09960 1/20 0.51
LSS P48449 2/20 0.50
PPARG P37231 3/20 0.49
PPARD Q03181 1/20 0.49
PKM P14618 1/20 0.49
HRH4 Q9H3N8 1/20 0.48
KDM4E B2RXH2 1/20 0.48
POLB P06746 1/20 0.48
APEX1 P27695 1/20 0.48
TDP1 Q9NUW8 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methacrylic Acid SCHEMBL29173686 0.82 GAA (0.79) GAAPPARAELANEL3MBTL1LMNA
SCHEMBL12744484 0.82 L3MBTL1 (0.49) GAAL3MBTL1MAPTMAPK1HTT
SCHEMBL1067982 0.81 HTT (0.64) GAAPPARAELANEL3MBTL1LMNA
SCHEMBL6321328 0.81 GAA (0.82) GAAPPARAELANEL3MBTL1LMNA
SCHEMBL17065870 0.80 DRD2 (0.53) ELANEL3MBTL1LMNAMAPTMAPK1
SCHEMBL10061377 0.80 L3MBTL1 (0.54) L3MBTL1LMNAMAPK1SMN1; SMN2RAB9A
SCHEMBL28285215 0.79 PPARA (0.64) GAAPPARAL3MBTL1LMNAMAPT
SCHEMBL25347886 0.79 HTT (0.78) GAAPPARAELANEL3MBTL1LMNA
SCHEMBL29000488 0.79 ELANE (0.61) GAAPPARAELANEL3MBTL1LMNA
SCHEMBL11485988 0.79 PPARA (0.83) GAAPPARAL3MBTL1LMNAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120302041-A1 Energy Ray-Curable Polymer, an Energy Ray-Curable Adhesive Composition, an Adhesive Sheet and a Processing Method of a Semiconductor Wafer LINTEC CORPORATION (JP) 2012-11-29 US disclosed
US-8304920-B2 Energy ray-curable polymer, an energy ray-curable adhesive composition, an adhesive sheet and a processing method of a semiconductor wafer LINTEC CORPORATION (JP) 2012-11-06 US disclosed
US-20110104874-A1 Energy Ray-Curable Polymer, an Energy Ray-Curable Adhesive Composition, an Adhesive Sheet and a Processing Method of a Semiconductor Wafer LINTEC CORPORATION (JP) 2011-05-05 US disclosed
US-20100233868-A1 Adhesive Sheet and a Processing Method of Semiconductor Wafer, and a Manufacturing Method of Semiconductive Chip LINTEC CORPORATION (JP) 2010-09-16 US disclosed