SCHEMBL1887487

SCHEMBL1887487

COC(OC)[SiH2]CS

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9860483 0.78
SCHEMBL375788 0.77
SCHEMBL310298 0.73
SCHEMBL331418 0.73
SCHEMBL65537 0.73
SCHEMBL3953647 0.71
SCHEMBL8466931 0.71
SCHEMBL375876 0.71
SCHEMBL22263206 0.69
SCHEMBL15524288 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 212 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023013487-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-02-09 WO claimed
US-7518009-B2 Process for preparing mercaptoorganyl (alkoxysilanes) EVONIK DEGUSSA GMBH (DE) 2009-04-14 US claimed
US-20060252952-A1 Process for preparing mercaptoorganyl (alkoxysilanes) DEGUSSA AG (DE) 2006-11-09 US claimed
EP-4703405-A1 CRYSTALLINE POLYOXYALKYLENE-BASED POLYMER AND CURABLE COMPOSITION COMPRISING SAME Kaneka Corporation (JP) 2026-03-04 EP disclosed
EP-4682204-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2026-01-21 EP disclosed
EP-3929260-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2025-12-17 EP disclosed
EP-4484500-B1 CURABLE COMPOSITION, CURED PRODUCT THEREOF, ADHESIVE AGENT COMPRISING THE COMPOSITION AND LAMINATED BODY KANEKA CORP (JP) 2025-11-26 EP disclosed
EP-4011978-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2025-11-19 EP disclosed
EP-3950832-B1 CURABLE COMPOSITION AND CURED PRODUCT KANEKA CORP (JP) 2025-10-22 EP disclosed
EP-3889206-B1 POLYOXYALKYLENE POLYMER AND CURABLE COMPOSITION KANEKA CORP (JP) 2025-10-15 EP disclosed
US-12378406-B2 Mixture of polyoxyalkylene polymers and curable composition KANEKA CORPORATION (JP) 2025-08-05 US disclosed
US-20060052621-A1 Process for producing mercaptoorganyl (alkoxysilane) EVONIK DEGUSSA GMBH (DE) 2006-03-09 US disclosed
US-6995280-B2 Process for preparing (mercaptoorganyl)alkoxysilanes DEGUSSA AG (DE) 2006-02-07 US disclosed
US-20050124821-A1 Process for preparing (mercaptoorganyl)alkoxysilanes EVONIK OPERATIONS GMBH (DE) 2005-06-09 US disclosed
US-20050124822-A1 Process for the preparation of (mercaptoorganyl)alkoxysilanes EVONIK OPERATIONS GMBH (DE) 2005-06-09 US disclosed
EP-1538152-A1 Process for the preparation of (mercaptoorganyl)-alkoxysilanen Degussa AG (DE) 2005-06-08 EP disclosed
EP-1529782-A1 Process for preparing mercaptoorganyl alkoxy silanes Degussa AG (DE) 2005-05-11 EP disclosed
WO-1998045368-A1 OLEFIN (CO-)POLYMER COMPOSITIONS AND METHOD OF PRODUCING THE SAME CHISSO CORPORATION (JP) 1998-10-15 WO disclosed
EP-0564004-B1 A highly stereoregular polypropylene CHISSO CORP (JP) 1996-09-25 EP disclosed
EP-0564004-A1 A highly stereoregular polypropylene CHISSO CORPORATION (JP) 1993-10-06 EP disclosed