SCHEMBL18909699

SCHEMBL18909699

C/C=C\C=c1\cccc\c1=C\C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20344809 0.81
SCHEMBL24265823 0.81
SCHEMBL23961326 0.81
SCHEMBL819351 0.81 TSHR (0.35)
SCHEMBL18387086 0.81 TSHR (0.35)
SCHEMBL19752457 0.79
Water SCHEMBL28283535 0.78 TSHR (0.33)
Methane SCHEMBL27622905 0.78 TSHR (0.33)
SCHEMBL13889187 0.78 ALDH1A1 (0.32)
SCHEMBL18175860 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230324798-A1 RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-12 US disclosed
US-11156916-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-26 US disclosed
US-11035051-B2 Acidic aqueous composition for electrolytic copper plating ATOTECH DEUTSCHLAND GMBH (DE) 2021-06-15 US disclosed
US-20190324368-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-10-24 US disclosed
US-20190203369-A1 ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING ATOTECH DEUTSCHLAND GMBH (DE) 2019-07-04 US disclosed
US-9938272-B2 Hydrazine compound as blood coagulation factor Xa inhibitor NORTH CHINA PHARMACEUTICAL COMPANY., LTD. (CN) 2018-04-10 US disclosed
US-20170152259-A1 HYDRAZINE COMPOUND AS BLOOD COAGULATION FACTOR Xa INHIBITOR NORTH CHINA PHARMACEUTICAL COMPANY., LTD. (CN) 2017-06-01 US disclosed