SCHEMBL1891774

SCHEMBL1891774

CCCCCCCCCOC(=O)CS

nearest known ligand 0.69

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
▸ NAAA Q02083 1/20 0.69
▸ RAD52 P43351 1/20 0.58
▸ NPSR1 Q6W5P4 1/20 0.58
▸ DGKA P23743 1/20 0.57
▸ FAAH O00519 2/20 0.56
▸ HTR2C P28335 1/20 0.55
▸ EPHX1 P07099 1/20 0.53
▸ TSHR P16473 3/20 0.52
▸ PRSS1 P07477 1/20 0.49
▸ PRSS2 P07478 1/20 0.49
▸ PRSS3 P35030 1/20 0.49
▸ HCAR2 Q8TDS4 1/20 0.48
▸ DNM1 Q05193 1/20 0.47
▸ ALDH1A1 P00352 1/20 0.47
▸ LMNA P02545 1/20 0.47
▸ ACHE P22303 2/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15900218 1.00 NAAA (0.69) NAAARAD52NPSR1DGKAFAAH
SCHEMBL11600194 1.00 NAAA (0.69) NAAARAD52NPSR1DGKAFAAH
SCHEMBL16389949 1.00 NAAA (0.69) NAAARAD52NPSR1DGKAFAAH
SCHEMBL9835095 1.00 NAAA (0.69) NAAARAD52NPSR1DGKAFAAH
SCHEMBL36142 1.00 NAAA (0.69) NAAARAD52NPSR1DGKAFAAH
SCHEMBL16389948 1.00 NAAA (0.69) NAAARAD52NPSR1DGKAFAAH
SCHEMBL16389865 1.00 NAAA (0.69) NAAARAD52NPSR1DGKAFAAH
SCHEMBL9833631 1.00 NAAA (0.69) NAAARAD52NPSR1DGKAFAAH
SCHEMBL3268158 1.00 NAAA (0.69) NAAARAD52NPSR1DGKAFAAH
SCHEMBL15900286 1.00 NAAA (0.69) NAAARAD52NPSR1DGKAFAAH

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 75 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-63063688-A — — None — — JP disclosed
EP-4567952-B1 CONDUCTIVE MATERIAL DISPERSION, CONDUCTIVE MATERIAL DISPERSION CONTAINING BINDER RESIN, SLURRY FOR ELECTRODE MEMBRANES, ELECTRODE MEMBRANE AND NONAQUEOUS ELECTROLYTE SECONDARY BATTERY ARTIENCE CO LTD (JP) 2026-04-22 — — EP disclosed
US-12606440-B2 Carbon nanotube dispersion composition, mixture slurry, electrode film, and secondary battery ARTIENCE CO., LTD. (JP) 2026-04-21 — — US disclosed
US-12600878-B2 Topcoat layer, a lamination film containing the same, and a decorative article decorated by said lamination film BASF COATINGS GMBH (DE) 2026-04-14 — — US disclosed
US-20250346775-A1 TOPCOAT LAYER, A LAMINATION FILM CONTAINING THE SAME, AND A DECORATIVE ARTICLE DECORATED BY SAID LAMINATION FILM BASF COATINGS GMBH (DE) 2025-11-13 — — US disclosed
EP-4261255-B1 CONDUCTIVE MATERIAL DISPERSION AND USE OF CONDUCTIVE MATERIAL DISPERSION ARTIENCE CO LTD (JP) 2025-11-05 — — EP disclosed
US-20250256969-A1 CARBON NANOTUBE DISPERSION COMPOSITION, MIXTURE SLURRY, ELECTRODE FILM, AND SECONDARY BATTERY ARTIENCE CO., LTD. (JP) 2025-08-14 — — US disclosed
US-20250219080-A1 SLURRY FOR POSITIVE ELECTRODE FILM, POSITIVE ELECTRODE FILM, SECONDARY BATTERY, AND METHOD FOR PRODUCING POSITIVE ELECTRODE FILM ARTIENCE CO., LTD. (JP) 2025-07-03 — — US disclosed
EP-4578828-A1 CARBON NANOTUBE DISPERSION COMPOSITION, MIXTURE SLURRY, ELECTRODE FILM, AND SECONDARY BATTERY artience Co., Ltd. (JP) 2025-07-02 — — EP disclosed
EP-4567952-A2 CONDUCTIVE MATERIAL DISPERSION, CONDUCTIVE MATERIAL DISPERSION CONTAINING BINDER RESIN, SLURRY FOR ELECTRODE MEMBRANES, ELECTRODE MEMBRANE AND NONAQUEOUS ELECTROLYTE SECONDARY BATTERY artience Co., Ltd. (JP) 2025-06-11 — — EP disclosed
US-20120302041-A1 Energy Ray-Curable Polymer, an Energy Ray-Curable Adhesive Composition, an Adhesive Sheet and a Processing Method of a Semiconductor Wafer LINTEC CORPORATION (JP) 2012-11-29 — — US disclosed
US-8304920-B2 Energy ray-curable polymer, an energy ray-curable adhesive composition, an adhesive sheet and a processing method of a semiconductor wafer LINTEC CORPORATION (JP) 2012-11-06 — — US disclosed
US-20110104874-A1 Energy Ray-Curable Polymer, an Energy Ray-Curable Adhesive Composition, an Adhesive Sheet and a Processing Method of a Semiconductor Wafer LINTEC CORPORATION (JP) 2011-05-05 — — US disclosed
US-20100233868-A1 Adhesive Sheet and a Processing Method of Semiconductor Wafer, and a Manufacturing Method of Semiconductive Chip LINTEC CORPORATION (JP) 2010-09-16 — — US disclosed
US-7160960-B2 Pressure sensitive adhesive composition and sheet, and adhered article TOYO INK MANUFACTURING CO., LTD. (JP) 2007-01-09 — — US disclosed
US-20050165146-A1 Pressure sensitive adhesive composition and sheet, and adhered article TOYO INK MANUFACTURING CO., LTD. (JP) 2005-07-28 — — US disclosed
US-5851662-A Adhesive sheet NEW OJI PAPER CO., LTD. (JP) 1998-12-22 — — US disclosed
EP-0745653-A1 PRESSURE-SENSITIVE ADHESIVE SHEET NEW OJI PAPER CO., LTD. (JP) 1996-12-04 — — EP disclosed
JP-S6363688-A PASSIVATING AGENT ON CATALYTIC CRACKING OF HYDROCARBON SAKAI CHEM IND CO LTD 1988-03-22 — — JP disclosed
US-RE29523-E Olefinic polymers stabilized with thioacyl trivalent phosphorus compounds BORG-WARNER CORPORATION (US) 1978-01-24 — — US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12600878-B2 Topcoat layer, a lamination film containing the same, and a decorative article decorated by said lamination film HHAT, HTR3D, EIF4A3 NAAA 987/4885RAD52 1057/4885NPSR1 3917/4885
US-12606440-B2 Carbon nanotube dispersion composition, mixture slurry, electrode film, and secondary battery ACP1, CCDC47, SEPTIN9 NAAA 3522/4885RAD52 1120/4885NPSR1 4365/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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