SCHEMBL1897241

SCHEMBL1897241

C=C(C)C(=O)OC(C)(C)OCC

nearest known ligand 0.47

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.47
ALDH1A1 P00352 5/20 0.39
TSHR P16473 5/20 0.37
LMNA P02545 1/20 0.31
HSD17B10 Q99714 1/20 0.31
GAA P10253 2/20 0.30
MGAM O43451 1/20 0.30
SI P14410 1/20 0.30
MGAM2 Q2M2H8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10834615 0.83 THRB (0.42) THRBALDH1A1TSHRLMNAHSD17B10
SCHEMBL8849501 0.82 ALDH1A1 (0.50) THRBALDH1A1TSHRHSD17B10GAA
SCHEMBL11219958 0.82 THRB (0.41) THRBALDH1A1TSHRLMNAHSD17B10
SCHEMBL3419173 0.81 TSHR (0.49) THRBALDH1A1TSHR
SCHEMBL28436042 0.81 THRB (0.44) THRBALDH1A1TSHRLMNAHSD17B10
SCHEMBL24685151 0.80 THRB (0.40) THRBALDH1A1TSHR
SCHEMBL29059847 0.80 THRB (0.40) THRBALDH1A1TSHR
SCHEMBL27293668 0.80 THRB (0.40) THRBALDH1A1TSHRGAA
SCHEMBL1779168 0.80 THRB (0.44) THRBALDH1A1TSHR
SCHEMBL27910518 0.79 THRB (0.42) THRBALDH1A1TSHRLMNAHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20110198730-A1 HYPERBRANCHED POLYMER SYNTHESIZING METHOD, HYPERBRANCHED POLYMER, RESIST COMPOSITION, SEMICONDUCTOR INTEGRATED CIRCUIT, AND SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION METHOD LION CORPORATION 2011-08-18 US disclosed
US-20110101503-A1 HYPERBRANCHED POLYMER SYNTHESIZING METHOD, HYPERBRANCHED POLYMER, RESIST COMPOSITION, SEMICONDUCTOR INTEGRATED CIRCUIT, AND SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION METHOD LION CORPORATION (JP) 2011-05-05 US disclosed
EP-1426410-B1 PLASTICIZED THERMOPLASTIC RESIN COMPOSITION OF GOOD FLEXIBILITY BASF CORP (US) 2010-12-22 EP disclosed
US-20040162392-A1 Thermoplastic resin composition JOHNSON POLYMER, LLC 2004-08-19 US disclosed
EP-1426410-A1 THERMOPLASTIC RESIN COMPOSITION TOAGOSEI CO., LTD. (JP) 2004-06-09 EP disclosed