SCHEMBL19019482

SCHEMBL19019482

CC(C)CC(c1ccc(C(O)(C(F)(F)F)C(F)(F)F)cc1)C(C)C

nearest known ligand 0.50

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
▸ MLYCD O95822 8/20 0.50
▸ NR1H3 Q13133 11/20 0.46
▸ NR1H2 P55055 10/20 0.46
▸ GAA P10253 1/20 0.43
▸ MAPK1 P28482 1/20 0.43
▸ SMN1; SMN2 Q16637 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18030102 0.83 NR1H3 (0.49) MLYCDNR1H3NR1H2GAAMAPK1
SCHEMBL19323072 0.83 MLYCD (0.37) MLYCDNR1H3NR1H2GAAMAPK1
SCHEMBL18408683 0.83 MLYCD (0.49) MLYCDNR1H3NR1H2GAAMAPK1
SCHEMBL12836723 0.79 NR1H3 (0.49) MLYCDNR1H3NR1H2GAAMAPK1
SCHEMBL18698639 0.77 NR1H2 (0.53) MLYCDNR1H3NR1H2SMN1; SMN2
SCHEMBL6337812 0.77 NR1H2 (0.53) MLYCDNR1H3NR1H2SMN1; SMN2
SCHEMBL13324724 0.76 NR1H2 (0.56) MLYCDNR1H3NR1H2SMN1; SMN2
SCHEMBL18811509 0.75 TAAR1 (0.41) —
SCHEMBL2618661 0.74 NR1H2 (0.55) MLYCDNR1H3NR1H2
SCHEMBL18732577 0.72 TAAR1 (0.32) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10761426-B2 Pattern forming method, method for manufacturing electronic device, and laminate FUJIFILM CORPORATION (JP) 2020-09-01 — — US disclosed
US-20180180996-A1 PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND LAMINATE FUJIFILM CORPORATION (JP) 2018-06-28 — — US disclosed
US-9969829-B2 Polymer compound, negative resist composition, laminate, patterning process, and compound SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-05-15 — — US disclosed
US-20170210836-A1 POLYMER COMPOUND, NEGATIVE RESIST COMPOSITION, LAMINATE, PATTERNING PROCESS, AND COMPOUND SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-07-27 — — US disclosed
US-20170176862-A1 PATTERN FORMING METHOD, COMPOSITION FOR FORMING PROTECTIVE FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2017-06-22 — — US disclosed
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