SCHEMBL190199

SCHEMBL190199

CC(C)(O)C#CC(C)(C)O

nearest known ligand 0.33

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.33
THRB P10828 1/20 0.33
TSHR P16473 1/20 0.31
RECQL P46063 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL179477 0.88
SCHEMBL417933 0.82 ALDH1A1 (0.41) ALDH1A1RECQL
Acetic Acid SCHEMBL10352233 0.82 FFAR3 (0.47) ALDH1A1TSHRL3MBTL1
SCHEMBL9393616 0.82
SCHEMBL2952417 0.79 CA2 (0.35)
SCHEMBL17061383 0.79 ALDH1A1 (0.37) ALDH1A1
SCHEMBL15197558 0.79 TSHR (0.33) TSHR
SCHEMBL10619155 0.79
SCHEMBL11986 0.79
SCHEMBL13818441 0.77 TSHR (0.32) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2858 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12459060-B2 Solder paste SENJU METAL INDUSTRY CO., LTD. (JP) 2025-11-04 US claimed
EP-3733791-B1 AQUEOUS INK FOR INKJET RECORDING KAO CORP (JP) 2025-08-13 EP claimed
US-12365054-B2 Flux and solder paste SENJU METAL INDUSTRY CO., LTD. 2025-07-22 US claimed
EP-4554797-A1 ANTI-COUNTERFEITING LABEL FOR THE AUTHENTICATION OF GOODS Politecnico di Milano (IT) 2025-05-21 EP claimed
US-12233484-B2 Flux and solder paste SENJU METAL INDUSTRY CO., LTD. (JP) 2025-02-25 US claimed
CN-119431109-A Industrial production method and production device of 2, 5-dimethyl-3-hexyne-2, 5-diol 李世兵 2025-02-14 CN claimed
CN-115928246-B Preparation method of polyester staple fibers 湖北博韬合纤股份有限公司 2024-12-13 CN claimed
CN-118271534-B Thickener, soldering flux containing thickener, and preparation method and application of soldering flux 化学与精细化工广东省实验室 2024-08-23 CN claimed
CN-118271534-A Thickener, soldering flux containing thickener, and preparation method and application of soldering flux 化学与精细化工广东省实验室 2024-07-02 CN claimed
EP-3472671-B1 A RINSE COMPOSITION, A METHOD FOR FORMING RESIST PATTERNS AND A METHOD FOR MAKING SEMICONDUCTOR DEVICES MERCK PATENT GMBH (DE) 2024-06-26 EP claimed
CN-1074209-A Process for synthetizing tetramethyl-butanediol with acetylene acetone ZHOU ZICHENG (CN) 1993-07-14 CN claimed
US-5204435-A Curable polysiloxane core SHIN-ETSU CHEMICAL CO., LTD. (JP) 1993-04-20 US claimed
US-5194538-A Hydroxy Initiators POLYSAR CORPORATION (CA) 1993-03-16 US claimed
US-5064749-A DAMPENING WATER COMPOSITION FOR LITHOGRAPHIC PLATE FUJI PHOTO FILM CO., LTD. (JP) 1991-11-12 US claimed
US-4944893-A FOR SEMICONDUCTORS, ACETYLENIC ALCOHOL TOKYO OHKA KOGYO CO., LTD. (JP) 1990-07-31 US claimed
EP-0192130-B1 CORROSION INHIBITOR COMPOSITION HENKEL CORPORATION (a Delaware corp.) (US) 1990-06-27 EP claimed
EP-0192130-A2 Corrosion inhibitor composition HENKEL CORPORATION (a Delaware corp.) (US) 1986-08-27 EP claimed
EP-0103332-A1 Process and composition for coating a metallic substrate with a polymeric film ANIC S.p.A. (IT) 1984-03-21 EP claimed
EP-0049358-A1 Strontium and barium containing alkoxylation systems for unsaturated alcohols Conoco Phillips Company (US) 1982-04-14 EP claimed
US-4214924-A TREATMENT WITH A MONOACETYLENIC ALCOHOL PENNWALT CORPORATION (US) 1980-07-29 US claimed