Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NPC1 | O15118 | 12/20 | 0.69 |
| ▸ | RAB9A | P51151 | 12/20 | 0.69 |
| ▸ | KDM4E | B2RXH2 | 10/20 | 0.69 |
| ▸ | PKM | P14618 | 6/20 | 0.69 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.69 |
| ▸ | SMN1; SMN2 | Q16637 | 8/20 | 0.63 |
| ▸ | HPGD | P15428 | 3/20 | 0.63 |
| ▸ | METAP2 | P50579 | 3/20 | 0.63 |
| ▸ | METAP1 | P53582 | 2/20 | 0.63 |
| ▸ | LMNA | P02545 | 1/20 | 0.63 |
| ▸ | MTOR | P42345 | 1/20 | 0.63 |
| ▸ | ADORA3 | P0DMS8 | 2/20 | 0.61 |
| ▸ | ADORA2A | P29274 | 1/20 | 0.61 |
| ▸ | ADORA1 | P30542 | 1/20 | 0.61 |
| ▸ | GAA | P10253 | 1/20 | 0.61 |
| ▸ | LDHA | P00338 | 1/20 | 0.59 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.59 |
| ▸ | TP53 | P04637 | 4/20 | 0.58 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.58 |
| ▸ | TSHR | P16473 | 2/20 | 0.58 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29855452 | 1.00 | NPC1 (0.69) | NPC1RAB9AKDM4EPKMALDH1A1 | |
| SCHEMBL25138040 | 0.88 | NPC1 (0.62) | NPC1RAB9AKDM4EPKMALDH1A1 | |
| SCHEMBL25138042 | 0.86 | NPC1 (0.61) | NPC1RAB9AKDM4EPKMALDH1A1 | |
| SCHEMBL12696292 | 0.84 | NPC1 (0.54) | NPC1RAB9AKDM4EPKMALDH1A1 | |
| SCHEMBL14969101 | 0.83 | NPC1 (0.69) | NPC1RAB9AKDM4EPKMALDH1A1 | |
| SCHEMBL11460146 | 0.82 | NPC1 (0.61) | NPC1RAB9AKDM4EPKMALDH1A1 | |
| SCHEMBL10695095 | 0.82 | NPC1 (0.68) | NPC1RAB9AKDM4EPKMALDH1A1 | |
| SCHEMBL2415345 | 0.82 | NPC1 (1.00) | NPC1RAB9AKDM4EPKMALDH1A1 | |
| SCHEMBL18573267 | 0.82 | NPC1 (0.61) | NPC1RAB9AKDM4EPKMALDH1A1 | |
| SCHEMBL3054720 | 0.82 | NPC1 (0.68) | NPC1RAB9AKDM4EPKMALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10679887-B2 | Handler bonding and debonding for semiconductor dies | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2020-06-09 | — | — | US | claimed |
| US-20200176297-A1 | HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2020-06-04 | — | — | US | claimed |
| US-10586726-B2 | Handler bonding and debonding for semiconductor dies | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2020-03-10 | — | — | US | claimed |
| CN-108431949-A | Processor bonding and stripping for semiconductor dies | 国际商业机器公司 | 2018-08-21 | — | — | CN | claimed |
| US-20180218934-A1 | HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2018-08-02 | — | — | US | claimed |
| US-20180138073-A1 | HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2018-05-17 | — | — | US | claimed |
| US-9947570-B2 | Handler bonding and debonding for semiconductor dies | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2018-04-17 | — | — | US | claimed |
| US-20170194186-A1 | HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2017-07-06 | — | — | US | claimed |
| US-10679887-B2 | Handler bonding and debonding for semiconductor dies | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2020-06-09 | — | — | US | disclosed |
| US-10679887-B2 | Handler bonding and debonding for semiconductor dies | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2020-06-09 | — | — | US | disclosed |
| US-20200176297-A1 | HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2020-06-04 | — | — | US | disclosed |
| US-20200176297-A1 | HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2020-06-04 | — | — | US | disclosed |
| US-10586726-B2 | Handler bonding and debonding for semiconductor dies | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2020-03-10 | — | — | US | disclosed |
| US-20180218934-A1 | HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2018-08-02 | — | — | US | disclosed |
| US-20180138073-A1 | HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2018-05-17 | — | — | US | disclosed |
| US-20180138073-A1 | HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2018-05-17 | — | — | US | disclosed |
| US-9947570-B2 | Handler bonding and debonding for semiconductor dies | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2018-04-17 | — | — | US | disclosed |
| US-9947570-B2 | Handler bonding and debonding for semiconductor dies | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2018-04-17 | — | — | US | disclosed |
| US-20170194186-A1 | HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2017-07-06 | — | — | US | disclosed |
| US-20170194186-A1 | HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2017-07-06 | — | — | US | disclosed |