SCHEMBL19085374

SCHEMBL19085374

Cc1cc(C(C)(C)Oc2c(C)cc(-c3cc(C)c(OC(C)(C)c4cc(C)c(OC(C)C)c(C)c4)c(C)c3C)c(C)c2C)cc(C)c1OC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19085373 0.81
SCHEMBL27118938 0.75 ALDH1A1 (0.33)
SCHEMBL12401803 0.73 POLB (0.43)
SCHEMBL14540271 0.70
SCHEMBL12636687 0.67 NPC1 (0.35)
SCHEMBL19354012 0.67 TAS1R3 (0.35)
SCHEMBL12517837 0.66 FFAR4 (0.41)
SCHEMBL24066399 0.66
SCHEMBL22681486 0.65 CYP1A2 (0.32)
SCHEMBL19940003 0.64 PLAU (0.42)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024043084-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2024-02-29 WO disclosed
WO-2024043083-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2024-02-29 WO disclosed
WO-2024018945-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2024-01-25 WO disclosed
US-20170190837-A1 MODIFIED POLYPHENYLENE ETHER RESIN, METHOD OF MAKING THE SAME AND RESIN COMPOSITION ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) 2017-07-06 US disclosed