SCHEMBL19144129

SCHEMBL19144129

CCC(C)(CC)CCC(=O)OCCCCOC(=O)CCN1CCNCC1

nearest known ligand 0.40

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
▸ HRH2 P25021 1/20 0.40
▸ HRH1 P35367 1/20 0.40
▸ MEN1 O00255 2/20 0.40
▸ KMT2A Q03164 2/20 0.40
▸ MAPT P10636 2/20 0.40
▸ ALDH1A1 P00352 1/20 0.40
▸ SMN1; SMN2 Q16637 1/20 0.40
▸ THRB P10828 2/20 0.34
▸ HRH3 Q9Y5N1 6/20 0.33
▸ SIGMAR1 Q99720 1/20 0.33
▸ RECQL P46063 1/20 0.33
▸ L3MBTL1 Q9Y468 1/20 0.33
▸ LMNA P02545 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21125866 0.90 HRH2 (0.40) HRH2HRH1MEN1KMT2AMAPT
SCHEMBL22743444 0.84 HRH2 (0.42) HRH2HRH1MEN1KMT2AMAPT
SCHEMBL6606038 0.83 HRH2 (0.54) HRH2HRH1MEN1KMT2AMAPT
SCHEMBL16062671 0.82 HRH2 (0.45) HRH2HRH1MEN1KMT2ATHRB
SCHEMBL22743451 0.77 HRH2 (0.39) HRH2HRH1MEN1KMT2AMAPT
SCHEMBL14651718 0.77 HRH2 (0.38) HRH2HRH1MEN1KMT2AMAPT
SCHEMBL29001314 0.77 HRH2 (0.54) HRH2HRH1THRBLMNA
SCHEMBL16062670 0.77 HRH2 (0.40) HRH2HRH1MEN1KMT2AMAPT
SCHEMBL1341702 0.77 TSHR (0.43) HRH2HRH1MEN1KMT2AALDH1A1
SCHEMBL16062677 0.76 LMNA (0.39) HRH2HRH1MEN1KMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11745302-B2 Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process APPLIED MATERIALS, INC. (US) 2023-09-05 — — US disclosed
US-10391605-B2 Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process APPLIED MATERIALS, INC. (US) 2019-08-27 — — US disclosed
US-20170203408-A1 METHOD AND APPARATUS FOR FORMING POROUS ADVANCED POLISHING PADS USING AN ADDITIVE MANUFACTURING PROCESS APPLIED MATERIALS, INC. 2017-07-20 — — US disclosed
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