SCHEMBL19196497

SCHEMBL19196497

CC(=O)O/N=C(\C)c1ccc(Sc2ccc(C)cc2)cc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.55
L3MBTL1 Q9Y468 4/20 0.50
CASP3 P42574 1/20 0.50
SENP8 Q96LD8 1/20 0.50
SENP7 Q9BQF6 1/20 0.50
SENP6 Q9GZR1 1/20 0.50
HPGD P15428 3/20 0.47
LMNA P02545 3/20 0.47
MAPT P10636 6/20 0.43
PKM P14618 2/20 0.43
ALDH1A1 P00352 4/20 0.42
MAPK1 P28482 2/20 0.40
KDM4E B2RXH2 1/20 0.40
ALOX15 P16050 1/20 0.40
HSD17B10 Q99714 1/20 0.40
CDK5 Q00535 1/20 0.40
CDK5R1 Q15078 1/20 0.40
KMT2A Q03164 1/20 0.39
CTSK P43235 1/20 0.39
NPC1 O15118 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16581054 0.90 CYP1A2 (0.65) CYP1A2L3MBTL1CASP3SENP8SENP7
SCHEMBL12609522 0.90 CYP1A2 (0.65) CYP1A2L3MBTL1CASP3SENP8SENP7
SCHEMBL19196496 0.89 HPGD (0.63) CYP1A2L3MBTL1CASP3SENP8SENP7
SCHEMBL9962632 0.87 HPGD (0.59) CYP1A2L3MBTL1CASP3SENP8SENP7
SCHEMBL19795439 0.84 L3MBTL1 (0.57) CYP1A2L3MBTL1CASP3SENP8SENP7
SCHEMBL12101883 0.82 HPGD (0.42) CYP1A2L3MBTL1CASP3SENP8SENP7
SCHEMBL16480298 0.81 PLK1 (0.46) CYP1A2L3MBTL1CASP3SENP8SENP7
SCHEMBL12287582 0.81 HPGD (0.41) CYP1A2L3MBTL1CASP3SENP8SENP7
SCHEMBL9962625 0.81 MAPK1 (0.49) HPGDLMNAMAPTALDH1A1MAPK1
SCHEMBL12101888 0.80 ALDH1A1 (0.46) L3MBTL1CASP3SENP8SENP7SENP6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023163209-A1 CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD 太陽インキ製造株式会社 2023-08-31 WO disclosed
US-20170219923-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, PATTERN SUBSTRATE, PHOTOSENSITIVE CONDUCTIVE FILM, AND CONDUCTIVE PATTERN SUBSTRATE SHANGHAI JIAO TONG UNIVERSITY (CN) 2017-08-03 US disclosed
US-20170219923-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, PATTERN SUBSTRATE, PHOTOSENSITIVE CONDUCTIVE FILM, AND CONDUCTIVE PATTERN SUBSTRATE SHANGHAI JIAO TONG UNIVERSITY (CN) 2017-08-03 US disclosed