⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11764366 | 0.67 | — | — | |
| SCHEMBL17480221 | 0.67 | — | — | |
| SCHEMBL160834 | 0.65 | — | — | |
| SCHEMBL19206041 | 0.65 | — | — | |
| SCHEMBL3482088 | 0.62 | — | — | |
| SCHEMBL15674500 | 0.62 | — | — | |
| SCHEMBL472894 | 0.62 | — | — | |
| SCHEMBL6666453 | 0.62 | — | — | |
| SCHEMBL5014823 | 0.61 | — | — | |
| SCHEMBL11595822 | 0.60 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110819119-A | Composition and flame-retardant liquid heat-conducting silica gel foam | 苏州然创新材料科技有限公司 | 2020-02-21 | — | — | CN | disclosed |
| US-9117984-B2 | Encapsulating layer-covered optical semiconductor element, producing method thereof, and optical semiconductor device | NITTO DENKO CORPORATION (JP) | 2015-08-25 | — | — | US | disclosed |
| US-9115277-B2 | Porous polyolefin resin film | MITSUBISHI PLASTICS, INC. (JP) | 2015-08-25 | — | — | US | disclosed |
| US-9117984-B2 | Encapsulating layer-covered optical semiconductor element, producing method thereof, and optical semiconductor device | NITTO DENKO CORPORATION (JP) | 2015-08-25 | — | — | US | disclosed |
| US-9024353-B2 | Encapsulating sheet-covered semiconductor element and semiconductor device | NITTO DENKO CORPORATION (JP) | 2015-05-05 | — | — | US | disclosed |
| US-9024353-B2 | Encapsulating sheet-covered semiconductor element and semiconductor device | NITTO DENKO CORPORATION (JP) | 2015-05-05 | — | — | US | disclosed |
| US-20150076552-A1 | SILICONE RESIN COMPOSITION, SEMI-CURED MATERIAL SHEET, PRODUCING METHOD OF SILICONE CURED MATERIAL, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF | NITTO DENKO CORPORATION (JP) | 2015-03-19 | — | — | US | disclosed |
| US-20150076552-A1 | SILICONE RESIN COMPOSITION, SEMI-CURED MATERIAL SHEET, PRODUCING METHOD OF SILICONE CURED MATERIAL, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF | NITTO DENKO CORPORATION (JP) | 2015-03-19 | — | — | US | disclosed |
| US-20140183593-A1 | ENCAPSULATING LAYER-COVERED OPTICAL SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | NITTO DENKO CORPORATION (JP) | 2014-07-03 | — | — | US | disclosed |
| US-20140183593-A1 | ENCAPSULATING LAYER-COVERED OPTICAL SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE | NITTO DENKO CORPORATION (JP) | 2014-07-03 | — | — | US | disclosed |
| US-20130236793-A1 | POROUS POLYOLEFIN RESIN FILM | MITSUBISHI PLASTICS, INC. (JP) | 2013-09-12 | — | — | US | disclosed |
| EP-2626380-A1 | POROUS POLYOLEFIN RESIN FILM | Mitsubishi Plastics, Inc. (JP) | 2013-08-14 | — | — | EP | disclosed |
| US-7393911-B2 | Organosilicon fine particles and method of producing same | TAKEMOTO YUSHI KABUSHIKI KAISHA (JP) | 2008-07-01 | — | — | US | disclosed |
| US-20060089478-A1 | antireflection and antiblocking characteristics to synthetic polymer films and sheets when applied to their surface or caused to be contained, respectively, and adherence and slip characteristics to a skin care cosmetic material when caused to be contained | TAKEMOTO YUSHI KABUSHIKI KAISHA (JP) | 2006-04-27 | — | — | US | disclosed |
| EP-0768342-B1 | Curable organopolysiloxane compositions with improved adhesion | DOW CORNING (US) | 1998-11-11 | — | — | EP | disclosed |
| EP-0768342-A1 | Curable organopolysiloxane compositions with improved adhesion | DOW CORNING CORPORATION (US) | 1997-04-16 | — | — | EP | disclosed |
| US-5595826-A | Curable organopolysiloxane compositions with improved adhesion | DOW CORNING CORPORATION (US) | 1997-01-21 | — | — | US | disclosed |