Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.37 |
| ▸ | LMNA | P02545 | 2/20 | 0.35 |
| ▸ | TSHR | P16473 | 2/20 | 0.35 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.35 |
| ▸ | MEN1 | O00255 | 1/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5782637 | 0.79 | — | — | |
| SCHEMBL7245802 | 0.77 | — | — | |
| SCHEMBL10629424 | 0.69 | TSHR (0.35) | ALDH1A1SMN1; SMN2LMNATSHRHSD17B10 | |
| SCHEMBL19206144 | 0.69 | — | — | |
| SCHEMBL9663850 | 0.67 | LMNA (0.45) | ALDH1A1SMN1; SMN2LMNATSHRHSD17B10 | |
| SCHEMBL10446254 | 0.67 | — | — | |
| 1,4-Butanediol SCHEMBL10709999 | 0.62 | — | — | |
| 1,3-Propanediol SCHEMBL10605693 | 0.62 | — | — | |
| 1,4-Butanediol SCHEMBL6708433 | 0.62 | — | — | |
| 1,3-Propanediol SCHEMBL17164788 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11168406-B2 | Leveler compositions for use in copper deposition in manufacture of microelectronics | MACDERMID ENTHONE INC. (US) | 2021-11-09 | — | — | US | claimed |
| US-20200063280-A1 | Leveler Compositions for use in Copper Deposition in Manufacture of Microelectronics | MACDERMID ENTHONE INC. | 2020-02-27 | — | — | US | claimed |
| EP-3414277-A1 | LEVELER COMPOSITIONS FOR USE IN COPPER DEPOSITION IN MANUFACTURE OF MICROELECTRONICS | MacDermid Enthone Inc. (US) | 2018-12-19 | — | — | EP | claimed |
| WO-2017139087-A1 | LEVELER COMPOSITIONS FOR USE IN COPPER DEPOSITION IN MANUFACTURE OF MICROELECTRONICS | MACDERMID ENTHONE INC. (US) | 2017-08-17 | — | — | WO | claimed |
| US-20170233883-A1 | Leveler Compositions for Use in Copper Deposition in Manufacture of Microelectronics | CITIBANK, N.A. | 2017-08-17 | — | — | US | claimed |
| US-11168406-B2 | Leveler compositions for use in copper deposition in manufacture of microelectronics | MACDERMID ENTHONE INC. (US) | 2021-11-09 | — | — | US | disclosed |
| US-20210310141-A1 | Leveler Compositions for use in Copper Deposition in Manufacture of Microelectronics | MACDERMID ENTHONE INC (US) | 2021-10-07 | — | — | US | disclosed |
| US-20200063280-A1 | Leveler Compositions for use in Copper Deposition in Manufacture of Microelectronics | MACDERMID ENTHONE INC. | 2020-02-27 | — | — | US | disclosed |
| US-20170233883-A1 | Leveler Compositions for Use in Copper Deposition in Manufacture of Microelectronics | CITIBANK, N.A. | 2017-08-17 | — | — | US | disclosed |