SCHEMBL1927788

SCHEMBL1927788

CCN(CC)[Ti](N(CC)CC)(N(C(C)C)C(C)C)N(C(C)C)C(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1928879 0.94
SCHEMBL6564295 0.77
SCHEMBL42413 0.73
SCHEMBL2121122 0.65
Sulfuric Acid SCHEMBL2545783 0.63
SCHEMBL3170288 0.56 CA1 (0.30)
SCHEMBL31677454 0.56 MGLL (0.30)
SCHEMBL20811 0.56
SCHEMBL1746 0.56
SCHEMBL7097725 0.56

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2069369-B1 HETEROLEPTIC ORGANOMETALLIC COMPOUNDS PRAXAIR TECHNOLOGY INC (US) 2016-11-23 EP claimed
US-9362475-B2 Thermoelectric material including conformal oxide layers and method of making the same using atomic layer deposition GM Global Technology Operations LLC (US) 2016-06-07 US claimed
US-20150270466-A1 THERMOELECTRIC MATERIAL AND METHOD OF MAKING THE SAME GM Global Technology Operations LLC (US) 2015-09-24 US claimed
US-7956207-B2 such as bis(dimethylamino)bis(bis(trimethylsilyl)amino)hafnium, used as films on substrates such as wafers in the manufacture of semiconductors, dielectrics, barriers and electrodes having heat resistance PRAXAIR TECHNOLOGY, INC. (US) 2011-06-07 US claimed
US-7799671-B1 Interfacial layers for electromigration resistance improvement in damascene interconnects NOVELLUS SYSTEMS, INC. (US) 2010-09-21 US claimed
US-7648899-B1 Interfacial layers for electromigration resistance improvement in damascene interconnects NOVELLUS SYSTEMS, INC. (US) 2010-01-19 US claimed
EP-2069369-A1 HETEROLEPTIC ORGANOMETALLIC COMPOUNDS PRAXAIR TECHNOLOGY, INC. (US) 2009-06-17 EP claimed
WO-2008039960-A1 HETEROLEPTIC ORGANOMETALLIC COMPOUNDS PRAXAIR TECHNOLOGY, INC. (US) 2008-04-03 WO claimed
US-20080081922-A1 Heteroleptic organometallic compounds PRAXAIR TECHNOLOGY, INC. 2008-04-03 US claimed
US-20250314008-A1 Ceramic-Polymer Composites and Methods of Making the Same TEMPLE UNIVERSITY OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION 2025-10-09 US disclosed
US-12091814-B2 Ceramic-polymer composites and methods of making the same TEMPLE UNIVERSITY-OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION (US) 2024-09-17 US disclosed
US-20200354883-A1 Ceramic-Polymer Composites and Methods of Making the Same TEMPLE UNIVERSITY-OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION 2020-11-12 US disclosed
EP-2259303-B1 Interfacial capping layers for interconnects NOVELLUS SYSTEMS INC (US) 2018-09-19 EP disclosed
EP-2188413-B1 METHOD FOR ATOMIC LAYER DEPOSITION USING AN ATMOSPHERIC PRESSURE GLOW DISCHARGE PLASMA FUJIFILM MFG EUROPE BV (NL) 2018-07-11 EP disclosed
US-20080119098-A1 Atomic layer deposition on fibrous materials HONEYWELL INTERNATINAL INC. 2008-05-22 US disclosed
WO-2008039960-A1 HETEROLEPTIC ORGANOMETALLIC COMPOUNDS PRAXAIR TECHNOLOGY, INC. (US) 2008-04-03 WO disclosed
US-20080081922-A1 Heteroleptic organometallic compounds PRAXAIR TECHNOLOGY, INC. 2008-04-03 US disclosed
US-7312165-B2 Codeposition of hafnium-germanium oxides on substrates used in or for semiconductor devices JURSICH GREGORY M 2007-12-25 US disclosed
WO-2007145513-A1 METHOD AND APPARATUS FOR ATOMIC LAYER DEPOSITION USING AN ATMOSPHERIC PRESSURE GLOW DISCHARGE PLASMA FUJIFILM MANUFACTURING EUROPE B.V. (NL) 2007-12-21 WO disclosed
US-20050266700-A1 Codeposition of hafnium-germanium oxides on substrates used in or for semiconductor devices JURSICH GREGORY M 2005-12-01 US disclosed