SCHEMBL1931997

SCHEMBL1931997

C=C(C)C(=O)OCCCCl

nearest known ligand 0.62

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 5/20 0.62
THRB P10828 1/20 0.53
TDP1 Q9NUW8 2/20 0.50
POLB P06746 1/20 0.50
APEX1 P27695 1/20 0.50
HTT P42858 1/20 0.50
ALDH1A1 P00352 4/20 0.41
HPGD P15428 1/20 0.32
CA1 P00915 2/20 0.31
CA2 P00918 2/20 0.31
CYP3A4 P08684 1/20 0.31
HSD17B10 Q99714 1/20 0.31
CHRM5 P08912 1/20 0.30
CHRM1 P11229 1/20 0.30
CHRM3 P20309 1/20 0.30
ATM Q13315 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8651324 0.94 TSHR (0.66) TSHRTHRBTDP1POLBAPEX1
SCHEMBL750600 0.92 TSHR (0.59) TSHRTHRBTDP1POLBAPEX1
SCHEMBL5710460 0.92 TSHR (0.69) TSHRTHRBTDP1POLBAPEX1
SCHEMBL9645206 0.92 TSHR (0.69) TSHRTHRBTDP1POLBAPEX1
SCHEMBL3193637 0.92 TSHR (0.69) TSHRTHRBTDP1POLBAPEX1
SCHEMBL28924377 0.92 TSHR (0.69) TSHRTHRBTDP1POLBAPEX1
SCHEMBL9001839 0.90 TSHR (0.61) TSHRTHRBTDP1POLBAPEX1
SCHEMBL9136472 0.90 TSHR (0.67) TSHRTHRBTDP1POLBAPEX1
SCHEMBL28058746 0.89 TSHR (0.51) TSHRTHRBTDP1POLBAPEX1
SCHEMBL749835 0.88 THRB (0.52) TSHRTHRBTDP1POLBAPEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 71 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118112889-A Photosensitive resist composition and dry film resist 杭州福斯特电子材料有限公司 2024-05-31 CN claimed
CN-113546361-A Ammonium oligomeric phosphate-based composite forest dry powder extinguishing agent and preparation method and application thereof 湖南神州防务科技有限公司 2021-10-26 CN claimed
US-8904930-B2 Flexographic printing original plate capable of being laser-engraved TOYO BOSEKI KABUSHIKI KAISHA (JP) 2014-12-09 US claimed
WO-2025070605-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2025-04-03 WO disclosed
WO-2025028429-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2025-02-06 WO disclosed
WO-2024262603-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2024-12-26 WO disclosed
WO-2024262604-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATED BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATED BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2024-12-26 WO disclosed
CN-118955321-A Novel fluorine-containing surfactant, fluorine-containing acrylic polymer and application thereof 中国科学院上海有机化学研究所 2024-11-15 CN disclosed
CN-118112889-A Photosensitive resist composition and dry film resist 杭州福斯特电子材料有限公司 2024-05-31 CN disclosed
CN-118016891-A Binder composition for secondary battery 广东省皓智科技有限公司 2024-05-10 CN disclosed
CN-114342124-B Binder composition for secondary battery 广东省皓智科技有限公司 2024-04-09 CN disclosed
US-4746455-A SHRINK RESISTANCE FOR FELTS KAO CORPORATION (JP) 1988-05-24 US disclosed
EP-0251188-A2 Liquid detergent composition for clothing articles Kao Corporation (JP) 1988-01-07 EP disclosed
EP-0249380-A2 Shade enhancing agent Kao Corporation (JP) 1987-12-16 EP disclosed
EP-0220026-A2 Silica or alumina sol using reactive monomer as dispersion medium SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1987-04-29 EP disclosed
US-4639491-A CATIONIC POLYMER WITH LIPOPHILIC GROUPS KAO CORPORATION (JP) 1987-01-27 US disclosed
EP-0121140-A1 Fluoroacrylic copolymer Daikin Kogyo Co., Ltd. (JP) 1984-10-10 EP disclosed
US-4041017-A Reactive light-sensitive high polymer compound containing furyl pentadienic ester groups and insolubilized by action of heat, light or electron beams FUJI PHOTO FILM CO., LTD. (JA) 1977-08-09 US disclosed
US-4012559-A Radiation curable coating composition and precoated metal having top coat based on the same TORAY INDUSTRIES, INC (JA) 1977-03-15 US disclosed
US-3931248-A Reactive high polymer compound FUJI PHOTO FILM CO., LTD. (JA) 1976-01-06 US disclosed