⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3396395 | 0.81 | — | — | |
| SCHEMBL17222348 | 0.78 | — | — | |
| SCHEMBL9541497 | 0.74 | — | — | |
| SCHEMBL17222388 | 0.71 | — | — | |
| SCHEMBL9804568 | 0.69 | — | — | |
| SCHEMBL5698270 | 0.67 | ALDH1A1 (0.35) | — | |
| SCHEMBL7170167 | 0.66 | MAPT (0.32) | — | |
| SCHEMBL2106334 | 0.66 | PDE9A (0.32) | — | |
| SCHEMBL18377515 | 0.65 | — | — | |
| SCHEMBL9257505 | 0.64 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-106687864-B | Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrate | 日立化成株式会社 | 2020-07-03 | — | — | CN | disclosed |
| US-10656521-B2 | Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrate | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-05-19 | — | — | US | disclosed |
| US-20170329220-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING CIRCUIT SUBSTRATE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2017-11-16 | — | — | US | disclosed |
| US-20170261852-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING CIRCUIT SUBSTRATE | RESONAC CORPORATION (JP) | 2017-09-14 | — | — | US | disclosed |