Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | BCHE | P06276 | 8/20 | 0.40 |
| ▸ | TSHR | P16473 | 3/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.36 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
| ▸ | GAA | P10253 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
| ▸ | PTGER4 | P35408 | 2/20 | 0.33 |
| ▸ | PTGER3 | P43115 | 2/20 | 0.33 |
| ▸ | PTGER2 | P43116 | 2/20 | 0.33 |
| ▸ | LPAR1 | Q92633 | 1/20 | 0.33 |
| ▸ | LPAR5 | Q9H1C0 | 1/20 | 0.33 |
| ▸ | CRHR1 | P34998 | 1/20 | 0.33 |
| ▸ | PTGER1 | P34995 | 1/20 | 0.33 |
| ▸ | ESR1 | P03372 | 1/20 | 0.33 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.33 |
| ▸ | CXCR5 | P32302 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL194697 | 0.82 | BCHE (0.42) | BCHETSHRMEN1ALDH1A1GAA | |
| SCHEMBL8244826 | 0.82 | EGFR (0.45) | ALDH1A1GAAKMT2APTGER4PTGER3 | |
| SCHEMBL28871816 | 0.75 | KDM4E (0.33) | BCHETSHRALDH1A1GAAESR1 | |
| SCHEMBL10790494 | 0.72 | GABRA1 (0.44) | TSHRMEN1ALDH1A1GAAKMT2A | |
| SCHEMBL11032897 | 0.71 | CHKA (0.46) | TSHRSMN1; SMN2MEN1ALDH1A1GAA | |
| SCHEMBL83762 | 0.71 | CHKA (0.46) | TSHRSMN1; SMN2MEN1ALDH1A1GAA | |
| SCHEMBL9638033 | 0.70 | TSHR (0.57) | TSHRSMN1; SMN2ALDH1A1GAAKMT2A | |
| SCHEMBL2516873 | 0.70 | SLC6A2 (0.49) | BCHETSHRMEN1ALDH1A1KMT2A | |
| SCHEMBL5909799 | 0.69 | CYP2C19 (0.48) | TSHRMEN1ALDH1A1KMT2A | |
| Hydrochloric Acid SCHEMBL4050783 | 0.69 | CHKA (0.44) | TSHRSMN1; SMN2MEN1GAAKMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 132 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114651025-B | Curable composition, cured product, fiber-reinforced composite material, molded article, and method for producing same | DIC株式会社 | 2024-06-04 | — | — | CN | disclosed |
| WO-2024095883-A1 | MODIFIER FOR THERMOPLASTIC RESIN, RESIN COMPOSITION, AND USE OF ROSIN RESIN | 荒川化学工業株式会社 | 2024-05-10 | — | — | WO | disclosed |
| WO-2024095878-A1 | MODIFIER FOR THERMOPLASTIC RESIN, RESIN COMPOSITION, USE OF HYDROGENATED AROMATIC HYDROCARBON RESIN, TACKIFIER, AND PRESSURE-SENSITIVE ADHESIVE OR ADHESIVE COMPOSITION | 荒川化学工業株式会社 | 2024-05-10 | — | — | WO | disclosed |
| WO-2024095880-A1 | MODIFYING AGENT FOR THERMOPLASTIC RESINS, RESIN COMPOSITION, AND USE OF HYDROGENATED AROMATIC HYDROCARBON RESIN | 荒川化学工業株式会社 | 2024-05-10 | — | — | WO | disclosed |
| EP-4339220-A1 | CURABLE COMPOSITION, CURED OBJECT, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDED FIBER-REINFORCED RESIN ARTICLE | DIC Corporation (JP) | 2024-03-20 | — | — | EP | disclosed |
| CN-117043221-A | Curable composition, cured product, fiber-reinforced composite material, and fiber-reinforced resin molded article | DIC株式会社 | 2023-11-10 | — | — | CN | disclosed |
| EP-3708600-B1 | CURABLE COMPOSITION AND FIBER-REINFORCED COMPOSITE MATERIAL | DAINIPPON INK & CHEMICALS (JP) | 2023-07-19 | — | — | EP | disclosed |
| CN-111295408-B | Curable composition and fiber-reinforced composite material | DIC株式会社 | 2023-04-11 | — | — | CN | disclosed |
| US-20230033431-A1 | POLYPHENYLENE ETHER-BASED RESIN COMPOSITION AND MOLDED ARTICLE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-02-02 | — | — | US | disclosed |
| CN-115594965-A | Polyphenylene ether resin composition | 旭化成株式会社（JP） | 2023-01-13 | — | — | CN | disclosed |
| EP-1452564-A1 | FLAME-RETARDANT RESIN COMPOSITION | Teijin Chemicals, Ltd. (JP) | 2004-09-01 | — | — | EP | disclosed |
| US-20040063824-A1 | Resin component (Component A-1) containing 50 to 100% by weight of an aromatic polycarbonate resin and 0 to 50% by weight of a styrene-containing resin or (2) a resin component (Component A- 2) containing 20 to 80% by weight of a | TEIJIN CHEMICALS LTD. (JP) | 2004-04-01 | — | — | US | disclosed |
| US-20040039134-A1 | Phosphazene composition | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2004-02-26 | — | — | US | disclosed |
| US-20030176600-A1 | Polyphenylene ether resin composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2003-09-18 | — | — | US | disclosed |
| US-6133379-A | MELT MIXING THE POLYMERIC BLENDS CONTAINING VARIABLE RATIO OF VOLATILE COMPONENTS, FEEDING THE BLEND FROM A FIRST SUPPLY PORT OF MELT KNEADER, REMOVING VOLATILE UNDER REDUCED PRESSURE AND FEEDING A THIRD THERMOPLSTIC RESIN FROM SENCOND PORT | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 2000-10-17 | — | — | US | disclosed |
| US-5859176-A | Polyamide resin composition | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1999-01-12 | — | — | US | disclosed |
| US-RE35695-E | REARRANGEMENT; CYCLIZATION; RESISTANCE TO THERMAL OXIDATION | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1997-12-16 | — | — | US | disclosed |
| WO-1996016123-A1 | POLYAMIDE RESIN COMPOSITION | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1996-05-30 | — | — | WO | disclosed |
| EP-0407584-B1 | STABILIZED POLYPHENYLENE ETHER RESIN | ASAHI CHEMICAL IND (JP) | 1996-01-31 | — | — | EP | disclosed |
| US-5159027-A | Excellent resistance to thermal oxidation; therminal 6-chroman groups | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1992-10-27 | — | — | US | disclosed |