SCHEMBL194697

SCHEMBL194697

C=CCN(CC=C)Cc1cccc(C)c1Oc1c(C)cccc1CN(CC=C)CC=C

nearest known ligand 0.42

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
BCHE P06276 10/20 0.42
ALDH1A1 P00352 3/20 0.40
MEN1 O00255 2/20 0.40
KMT2A Q03164 2/20 0.40
TSHR P16473 1/20 0.40
GAA P10253 1/20 0.40
LMNA P02545 1/20 0.40
HTT P42858 1/20 0.40
MAPT P10636 2/20 0.35
KDM4E B2RXH2 2/20 0.35
L3MBTL1 Q9Y468 2/20 0.35
ESR1 P03372 1/20 0.34
ESR2 Q92731 1/20 0.34
PYCR1 P32322 1/20 0.33
OPRM1 P35372 1/20 0.33
OPRD1 P41143 1/20 0.33
OPRK1 P41145 1/20 0.33
ATM Q13315 1/20 0.33
TDP1 Q9NUW8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL194824 0.82 BCHE (0.40) BCHEALDH1A1MEN1KMT2ATSHR
SCHEMBL11526249 0.80 MAPT (0.50) BCHEALDH1A1MEN1KMT2AGAA
Hydrochloric Acid SCHEMBL859872 0.79 ESR1 (0.50) BCHEALDH1A1LMNAHTTMAPT
SCHEMBL10790494 0.79 GABRA1 (0.44) ALDH1A1MEN1KMT2ATSHRGAA
SCHEMBL15641981 0.78 MAPT (0.45) BCHETSHRMAPTKDM4E
SCHEMBL2121111 0.77 MAPT (0.50) BCHEALDH1A1MEN1KMT2AGAA
SCHEMBL15641887 0.75 BCHE (0.43) BCHETSHRMAPTKDM4E
Hydrochloric Acid SCHEMBL933510 0.75 MAPT (0.53) BCHEALDH1A1MEN1KMT2AGAA
SCHEMBL11667015 0.73 ALDH1A1 (0.56) BCHEALDH1A1MEN1KMT2ATSHR
SCHEMBL15641874 0.73 BCHE (0.46) BCHETSHRMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 137 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-9291209-A None JP disclosed
CN-114651025-B Curable composition, cured product, fiber-reinforced composite material, molded article, and method for producing same DIC株式会社 2024-06-04 CN disclosed
WO-2024095883-A1 MODIFIER FOR THERMOPLASTIC RESIN, RESIN COMPOSITION, AND USE OF ROSIN RESIN 荒川化学工業株式会社 2024-05-10 WO disclosed
WO-2024095878-A1 MODIFIER FOR THERMOPLASTIC RESIN, RESIN COMPOSITION, USE OF HYDROGENATED AROMATIC HYDROCARBON RESIN, TACKIFIER, AND PRESSURE-SENSITIVE ADHESIVE OR ADHESIVE COMPOSITION 荒川化学工業株式会社 2024-05-10 WO disclosed
WO-2024095880-A1 MODIFYING AGENT FOR THERMOPLASTIC RESINS, RESIN COMPOSITION, AND USE OF HYDROGENATED AROMATIC HYDROCARBON RESIN 荒川化学工業株式会社 2024-05-10 WO disclosed
EP-4339220-A1 CURABLE COMPOSITION, CURED OBJECT, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDED FIBER-REINFORCED RESIN ARTICLE DIC Corporation (JP) 2024-03-20 EP disclosed
CN-117043221-A Curable composition, cured product, fiber-reinforced composite material, and fiber-reinforced resin molded article DIC株式会社 2023-11-10 CN disclosed
EP-3708600-B1 CURABLE COMPOSITION AND FIBER-REINFORCED COMPOSITE MATERIAL DAINIPPON INK & CHEMICALS (JP) 2023-07-19 EP disclosed
CN-111295408-B Curable composition and fiber-reinforced composite material DIC株式会社 2023-04-11 CN disclosed
US-20230033431-A1 POLYPHENYLENE ETHER-BASED RESIN COMPOSITION AND MOLDED ARTICLE ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-02-02 US disclosed
US-20040063824-A1 Resin component (Component A-1) containing 50 to 100% by weight of an aromatic polycarbonate resin and 0 to 50% by weight of a styrene-containing resin or (2) a resin component (Component A- 2) containing 20 to 80% by weight of a TEIJIN CHEMICALS LTD. (JP) 2004-04-01 US disclosed
US-20040039134-A1 Phosphazene composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2004-02-26 US disclosed
US-20030176600-A1 Polyphenylene ether resin composition ASAHI KASEI CHEMICALS CORPORATION (JP) 2003-09-18 US disclosed
US-6133379-A MELT MIXING THE POLYMERIC BLENDS CONTAINING VARIABLE RATIO OF VOLATILE COMPONENTS, FEEDING THE BLEND FROM A FIRST SUPPLY PORT OF MELT KNEADER, REMOVING VOLATILE UNDER REDUCED PRESSURE AND FEEDING A THIRD THERMOPLSTIC RESIN FROM SENCOND PORT ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 2000-10-17 US disclosed
US-5859176-A Polyamide resin composition ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1999-01-12 US disclosed
US-RE35695-E REARRANGEMENT; CYCLIZATION; RESISTANCE TO THERMAL OXIDATION ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1997-12-16 US disclosed
JP-H09291209-A REINFORCED RESIN COMPOSITION ASAHI CHEM IND CO LTD 1997-11-11 JP disclosed
EP-0407584-B1 STABILIZED POLYPHENYLENE ETHER RESIN ASAHI CHEMICAL IND (JP) 1996-01-31 EP disclosed
US-5159027-A Excellent resistance to thermal oxidation; therminal 6-chroman groups ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1992-10-27 US disclosed
EP-0407584-A1 STABILIZED POLYPHENYLENE ETHER RESIN Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1991-01-16 EP disclosed