SCHEMBL195838

SCHEMBL195838

C=CC(=O)C(C=O)N=C=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7605395 0.84 ALDH1A1 (0.32)
SCHEMBL8856908 0.73
SCHEMBL27916180 0.73
SCHEMBL157304 0.71
SCHEMBL1518815 0.71
SCHEMBL8857141 0.69
SCHEMBL1162564 0.68
SCHEMBL7597281 0.67
SCHEMBL460539 0.64
SCHEMBL4564671 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2328984-B1 BIOMASS DERIVED RADIATION CURABLE LIQUID COATINGS PPG IND OHIO INC (US) 2018-08-01 EP claimed
US-8614286-B2 Biomass derived radiation curable liquid coatings PPG INDUSTRIES OHIO, INC. (US) 2013-12-24 US claimed
EP-2401337-A1 BIOMASS DERIVED RADIATION CURABLE LIQUID COATINGS PPG Industries Ohio, Inc. (US) 2012-01-04 EP claimed
EP-2328984-A1 BIOMASS DERIVED RADIATION CURABLE LIQUID COATINGS PPG Industries Ohio, Inc. (US) 2011-06-08 EP claimed
WO-2010099009-A1 BIOMASS DERIVED RADIATION CURABLE LIQUID COATINGS PPG INDUSTRIES OHIO, INC. (US) 2010-09-02 WO claimed
WO-2010027673-A1 BIOMASS DERIVED RADIATION CURABLE LIQUID COATINGS PPG INDUSTRIES OHIO, INC. (US) 2010-03-11 WO claimed
US-20100056705-A1 BIOMASS DERIVED RADIATION CURABLE LIQUID COATINGS PPG INDUSTRIES OHIO, INC. (US) 2010-03-04 US claimed
US-20100055483-A1 BIOMASS DERIVED RADIATION CURABLE LIQUID COATINGS PPG INDUSTRIES OHIO, INC. (US) 2010-03-04 US claimed
US-20250014937-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE RESONAC CORP (JP) 2025-01-09 US disclosed
US-20110048641-A1 METHOD FOR SEPARATING AND REMOVING DICING SURFACE PROTECTION TAPE FROM OBJECT TO BE CUT NITTO DENKO CORPORATION (JP) 2011-03-03 US disclosed
EP-1957552-A1 THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION SOLUTION, FILM FORMING MATERIAL AND THEIR CURED PRODUCT Showa Denko K.K. (JP) 2008-08-20 EP disclosed
WO-2007066816-A1 THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION SOLUTION, FILM FORMING MATERIAL AND THEIR CURED PRODUCT SHOWA DENKO K.K. (JP) 2007-06-14 WO disclosed
EP-0523723-B1 Resin composition MITSUI TOATSU CHEMICALS (JP) 1997-11-05 EP disclosed
US-5633317-A Isocyanate resin compositions and hot melt and pressure sensitive adhesives based thereon MITSUI TOATSU CHEMICALS, INC. (JP) 1997-05-27 US disclosed
EP-0508831-B1 Polymerizable compositions and in-mold cured products using the same TAKEMOTO OIL & FAT CO LTD (JP) 1996-06-19 EP disclosed
US-5418288-A Acrylic graft polymers with isocyanate group MITSUI TOATSU CHEMICALS, INC. (JP) 1995-05-23 US disclosed
US-5185417-A Unsaturated urethane and vinyl monomers; water resistance; improved appaearance; small mold shrinkage TAKEMOTO YUSHI, KABUSHIKI KAISHA (JP) 1993-02-09 US disclosed
EP-0523723-A1 Resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-01-20 EP disclosed
EP-0508831-A1 Polymerizable compositions and in-mold cured products using the same Takemoto Yushi Kabushiki Kaisha (JP) 1992-10-14 EP disclosed