SCHEMBL19640302

SCHEMBL19640302

O=S(=O)(O)CCCOCCCS(=O)(=O)O.[NaH]

nearest known ligand 0.48

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.48
PTGS1 P23219 1/20 0.39
PDE4A P27815 1/20 0.39
LMNA P02545 1/20 0.39
SLC6A6 P31641 1/20 0.39
CYP2C19 P33261 1/20 0.39
BLM P54132 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4731267 1.00 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL421993 0.97 APP (0.50) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL20875302 0.94 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL2191721 0.94 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL22160261 0.94 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL25299218 0.94 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL263732 0.92 APP (0.46) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL312671 0.92 APP (0.46) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL18380848 0.92 APP (0.46) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL193290 0.92 APP (0.46) APPPTGS1PDE4ALMNASLC6A6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112176366-B Electrolyte of high-ductility electrolytic copper foil and application 浙江花园新能源股份有限公司 2022-05-31 CN disclosed
CN-112301382-B Preparation method of high-ductility low-profile electrolytic copper foil 浙江花园新能源股份有限公司 2021-11-26 CN disclosed
CN-107447237-B Slip ring with reduced contact noise 史莱福灵有限公司 2021-04-20 CN disclosed
CN-107447237-B Slip ring with reduced contact noise 史莱福灵有限公司 2021-04-20 CN disclosed
CN-112301382-A Preparation method of high-ductility low-profile electrolytic copper foil 浙江大学 2021-02-02 CN disclosed
CN-112176366-A Electrolyte of high-ductility electrolytic copper foil and application 浙江大学 2021-01-05 CN disclosed
US-10666004-B2 Slipring with reduced contact noise SCHLEIFRING GMBH (DE) 2020-05-26 US disclosed
CN-107447237-A The slip ring of contact noise with reduction 滑动环及设备制造有限公司 2017-12-08 CN disclosed
US-20170346250-A1 SLIPRING WITH REDUCED CONTACT NOISE SCHLEIFRING GMBH (DE) 2017-11-30 US disclosed