SCHEMBL1965474

SCHEMBL1965474

Nc1cccc(C(F)(c2cccc(N)c2Oc2ccccc2)C(F)(F)C(F)(F)F)c1Oc1ccccc1

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 1/20 0.36
MAOA P21397 1/20 0.35
CA12 O43570 1/20 0.33
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33
CA7 P43166 1/20 0.33
CA13 Q8N1Q1 1/20 0.33
LTA4H P09960 1/20 0.33
TSHR P16473 1/20 0.33
MAPT P10636 4/20 0.33
POLB P06746 1/20 0.33
HSP90AA1 P07900 1/20 0.33
HTR1A P08908 1/20 0.32
SLC6A2 P23975 1/20 0.32
SLC6A4 P31645 1/20 0.32
SLC6A3 Q01959 1/20 0.32
CYP1A2 P05177 1/20 0.32
CYP3A4 P08684 1/20 0.32
CYP2C9 P11712 1/20 0.32
CYP2C19 P33261 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5426532 0.84 MAOB (0.38) MAOBMAOACA12CA1CA2
SCHEMBL10451330 0.83 MAOB (0.40) MAOBMAOACA12CA1CA2
SCHEMBL1965473 0.78 DPP4 (0.37) MAOBMAOALTA4HTSHRCYP1A2
SCHEMBL1966244 0.77 MAOB (0.40) MAOBMAOACA12CA1CA2
SCHEMBL8954705 0.76 MAOB (0.39) MAOBMAOACA12CA1CA2
SCHEMBL1964819 0.75 SMN1; SMN2 (0.39) CA1CA2TSHRMAPTPOLB
SCHEMBL7776603 0.75 LTA4H (0.52) MAOBMAOACA12CA1CA2
SCHEMBL6403569 0.75 RIPK1 (0.40) LTA4HTSHRHTR1ASLC6A2SLC6A4
SCHEMBL6004099 0.74 SMN1; SMN2 (0.38) TSHRMAPTPOLBCYP3A4KMT2A
SCHEMBL9617287 0.74 CD44 (0.38) TSHRMAPTPOLBCYP3A4KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-1095155-A None JP disclosed
CN-111830786-B Photosensitive resin composition containing silane coupling agent 波米科技有限公司 2023-05-23 CN disclosed
CN-112939915-A Diamine monomer for photosensitive resin, polyimide precursor, photosensitive resin composition, and use thereof 武汉柔显科技股份有限公司 2021-06-11 CN disclosed
EP-1296540-B1 DISPLAY TORAY INDUSTRIES (JP) 2019-10-16 EP disclosed
US-8409325-B2 Asymmetric gas separation membrane and process for gas separation UBE INDUSTRIES, LTD. (JP) 2013-04-02 US disclosed
US-20110232484-A1 ASYMMETRIC GAS SEPARATION MEMBRANE AND PROCESS FOR GAS SEPARATION UBE INDUSTRIES, LTD. (JP) 2011-09-29 US disclosed
EP-2335815-A1 ASYMMETRIC GAS SEPARATION MEMBRANE, AND GAS SEPARATION METHOD Ube Industries, Ltd. (JP) 2011-06-22 EP disclosed
US-6887643-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-05-03 US disclosed
EP-0878740-B1 Radiation sensitive polymer composition TORAY INDUSTRIES (JP) 2004-11-10 EP disclosed
US-20040053156-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2004-03-18 US disclosed
US-5851616-A Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO., LTD. (JP) 1998-12-22 US disclosed
EP-0878740-A1 Radiation sensitive polymer composition TORAY INDUSTRIES, INC. (JP) 1998-11-18 EP disclosed
US-5725948-A POLYIMIDE FROM A BISMALEIMIDE AND A DIAMINE TOMOEGAWA PAPER CO., LTD. (JP) 1998-03-10 US disclosed
US-5696235-A CONTAINING A BISMALEIMIDE; HEAT RESISTANCE, PROCESSABILITY; SOLUBLE IN VARIOUS ORGANIC SOLVENTS TOMOEGAWA PAPER CO., LTD. (JP) 1997-12-09 US disclosed
US-5663287-A SOLUBLE IN ORGANIC SOLVENTS AND EXCELS IN HEAT RESISTANCE TOMOEGAWA PAPER CO., LTD. (JP) 1997-09-02 US disclosed
US-5608013-A Polyimides and thermosetting resin compositions containing the same HITACHI CHEMICAL COMPANY, LTD. (JP) 1997-03-04 US disclosed
EP-0729996-A1 Polyimide and process for producing the same TOMOEGAWA PAPER CO. LTD. (JP) 1996-09-04 EP disclosed
EP-0456515-B1 Polyimides and thermosetting resin compositions containing the same HITACHI CHEMICAL CO LTD (JP) 1995-11-08 EP disclosed
EP-0456515-A1 Polyimides and thermosetting resin compositions containing the same Hitachi Chemical Co., Ltd. (JP) 1991-11-13 EP disclosed
JP-H0195155-A POLYIMIDE RESIN COMPOSITION MITSUBISHI KASEI CORP 1989-04-13 JP disclosed