Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 4/20 | 0.44 |
| ▸ | THRB | P10828 | 1/20 | 0.44 |
| ▸ | DNM1 | Q05193 | 7/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.35 |
| ▸ | LMNA | P02545 | 2/20 | 0.35 |
| ▸ | MEN1 | O00255 | 2/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.35 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.35 |
| ▸ | SLC22A1 | O15245 | 1/20 | 0.35 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22712594 | 1.00 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL22712627 | 0.78 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL19713161 | 0.76 | TSHR (0.42) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL2776155 | 0.76 | DNM1 (0.42) | TSHRDNM1ALDH1A1LMNAMEN1 | |
| SCHEMBL22712597 | 0.76 | TSHR (0.42) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL2774226 | 0.76 | — | — | |
| SCHEMBL18528558 | 0.75 | TSHR (0.46) | TSHRALDH1A1MEN1KMT2A | |
| SCHEMBL17163689 | 0.74 | TSHR (0.39) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL18789392 | 0.74 | THRB (0.40) | TSHRTHRBMEN1KMT2A | |
| Decane SCHEMBL3182487 | 0.71 | TSHR (0.73) | TSHRTHRBDNM1ALDH1A1LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220206404-A1 | HUMAN BODY-SAFE EXTERNAL ADDITIVE FOR TONER AND TONER MANUFACTURED USING SAME | Sukgyung AT Co., Ltd. (KR) | 2022-06-30 | — | — | US | disclosed |
| US-11181844-B2 | Toner and method of producing toner | CANON KABUSHIKI KAISHA (JP) | 2021-11-23 | — | — | US | disclosed |
| US-20200379363-A1 | TONER AND METHOD OF PRODUCING TONER | CANON KABUSHIKI KAISHA (JP) | 2020-12-03 | — | — | US | disclosed |
| CN-108026652-B | Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device, and method for manufacturing printed wiring board | ＪＸ金属株式会社 | 2019-10-25 | — | — | CN | disclosed |
| CN-110099518-A | The preparation method of resin base material, the preparation method of printing distributing board, the preparation method of the preparation method of printed circuit board and e-machine | JX日矿日石金属株式会社 | 2019-08-06 | — | — | CN | disclosed |
| CN-104685980-B | The manufacturing method and base substrate of multilayer printed wiring board | JX日矿日石金属株式会社 | 2018-11-23 | — | — | CN | disclosed |
| CN-108696988-A | The manufacturing method of attached release layer copper foil, laminate, the manufacturing method of printing distributing board and e-machine | ＪＸ金属株式会社 | 2018-10-23 | — | — | CN | disclosed |
| CN-108696998-A | The copper foil of attached release layer, the manufacturing method of laminate, the manufacturing method of printing distributing board and e-machine | ＪＸ金属株式会社 | 2018-10-23 | — | — | CN | disclosed |
| US-20180264783-A1 | Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring Board | JX NIPPON MINING & METALS CORPORATION (JP) | 2018-09-20 | — | — | US | disclosed |
| CN-108401362-A | The manufacturing method of metal foil, laminate, printing distributing board, semiconductor packages, e-machine and printing distributing board | ＪＸ金属株式会社 | 2018-08-14 | — | — | CN | disclosed |
| CN-108026652-A | Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device, and method for manufacturing printed wiring board | ＪＸ金属株式会社 | 2018-05-11 | — | — | CN | disclosed |
| CN-107921749-A | Surface-treated metal foil, laminate, printed wiring board, semiconductor package, electronic device, and method for manufacturing printed wiring board | ＪＸ金属株式会社 | 2018-04-17 | — | — | CN | disclosed |
| CN-107710890-A | Method for manufacturing printed wiring board, surface-treated copper foil, laminate, printed wiring board, semiconductor package, and electronic device | ＪＸ金属株式会社 | 2018-02-16 | — | — | CN | disclosed |
| CN-107529282-A | The copper foil of attached release layer, laminate, the manufacture method of the manufacture method of printing distributing board and e-machine | ＪＸ金属株式会社 | 2017-12-29 | — | — | CN | disclosed |
| US-20170362733-A1 | COPPER FOIL WITH RELEASE LAYER, LAMINATED MATERIAL, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING ELECTRONIC APPARATUS | JX NIPPON MINING & METALS CORPORATION (JP) | 2017-12-21 | — | — | US | disclosed |
| CN-104943255-A | Surface-treated copper foil, copper-clad laminate, printed wiring board, electronic device, semiconductor package, and method for manufacturing printed wiring board | JX NIPPON MINING & METALS CORP | 2015-09-30 | — | — | CN | disclosed |
| CN-104685980-A | Production method for multilayer printed wiring board, and base material | JX NIPPON MINING & METALS CORP | 2015-06-03 | — | — | CN | disclosed |
| CN-104661810-A | Carrier-attached metal foil, laminate comprising resin plate-like carrier and metal foil, and use thereof | JX NIPPON MINING & AMP | 2015-05-27 | — | — | CN | disclosed |