Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.38 |
| ▸ | THRB | P10828 | 1/20 | 0.38 |
| ▸ | LMNA | P02545 | 3/20 | 0.38 |
| ▸ | OPRM1 | P35372 | 1/20 | 0.37 |
| ▸ | DNM1 | Q05193 | 3/20 | 0.33 |
| ▸ | TRPM8 | Q7Z2W7 | 5/20 | 0.32 |
| ▸ | SPHK1 | Q9NYA1 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.31 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19713120 | 1.00 | TSHR (0.38) | TSHRTHRBLMNAOPRM1DNM1 | |
| SCHEMBL19713159 | 0.98 | OPRM1 (0.39) | TSHRTHRBLMNAOPRM1TRPM8 | |
| SCHEMBL8081829 | 0.90 | OPRM1 (0.35) | TSHRLMNAOPRM1 | |
| SCHEMBL5837368 | 0.90 | — | — | |
| SCHEMBL2049395 | 0.81 | TSHR (0.38) | TSHRTHRBLMNAOPRM1DNM1 | |
| SCHEMBL22712594 | 0.72 | TSHR (0.44) | TSHRTHRBLMNADNM1ALDH1A1 | |
| SCHEMBL19713161 | 0.70 | TSHR (0.42) | TSHRTHRBLMNADNM1ALDH1A1 | |
| SCHEMBL22712597 | 0.70 | TSHR (0.42) | TSHRTHRBLMNADNM1ALDH1A1 | |
| SCHEMBL15194653 | 0.70 | TSHR (0.57) | TSHRTHRBLMNADNM1ALDH1A1 | |
| SCHEMBL1203585 | 0.70 | TSHR (0.57) | TSHRTHRBLMNADNM1ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20180264783-A1 | Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring Board | JX NIPPON MINING & METALS CORPORATION (JP) | 2018-09-20 | — | — | US | disclosed |
| US-20170362733-A1 | COPPER FOIL WITH RELEASE LAYER, LAMINATED MATERIAL, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING ELECTRONIC APPARATUS | JX NIPPON MINING & METALS CORPORATION (JP) | 2017-12-21 | — | — | US | disclosed |