⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1973185 | 0.68 | ALDH1A1 (0.32) | — | |
| SCHEMBL25183756 | 0.66 | — | — | |
| SCHEMBL1971535 | 0.63 | ALDH1A1 (0.31) | — | |
| SCHEMBL7064687 | 0.59 | — | — | |
| SCHEMBL13740677 | 0.55 | DPP4 (0.56) | — | |
| SCHEMBL8284171 | 0.55 | DPP4 (0.56) | — | |
| SCHEMBL17297344 | 0.53 | — | — | |
| SCHEMBL14752170 | 0.52 | TSHR (0.30) | — | |
| SCHEMBL10762751 | 0.51 | TOP2A (0.42) | — | |
| SCHEMBL11711673 | 0.50 | TSHR (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0271107-B1 | MOLD CLEANING COMPOSITION, SHEET FOR CLEANING MOLD, AND METHOD FOR CLEANING MOLD USING SAID CLEANING SHEET | NITTO DENKO CORPORATION (JP) | 1993-06-02 | — | — | EP | claimed |
| US-4935175-A | SEMICONDUCTORS; UNCURED RUBBER AND REMOVAL AID OF IMIDAZOLES AND IMIDAZOLINES; CURING | NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1990-06-19 | — | — | US | claimed |
| EP-1813406-B1 | Sheet for regenerating a mold | NITTO DENKO CORP (JP) | 2011-06-22 | — | — | EP | disclosed |
| EP-1813406-A1 | Sheet for regenerating a mold | NITTO DENKO CORPORATION (JP) | 2007-08-01 | — | — | EP | disclosed |
| EP-0847843-B1 | Cleaning composition for mold for molding semiconductor device and method of cleaning mold using the same | NITTO DENKO CORP (JP) | 2001-11-21 | — | — | EP | disclosed |
| US-6077360-A | COMPRISING AN UNVULCANIZED RUBBER, A CLEANING AGENT, AND WATER | NITTO DENKO CORPORATION (JP) | 2000-06-20 | — | — | US | disclosed |
| US-5925605-A | CLEANING AND MOLDING FOR SEMICONDUCTORS USING UNVULCANIZED RUBBER | NITTO DENKO CORPORATION (JP) | 1999-07-20 | — | — | US | disclosed |
| EP-0847843-A1 | Cleaning composition for mold for molding semiconductor device and method of cleaning mold using the same | NITTO DENKO CORPORATION (JP) | 1998-06-17 | — | — | EP | disclosed |
| EP-0271107-B1 | MOLD CLEANING COMPOSITION, SHEET FOR CLEANING MOLD, AND METHOD FOR CLEANING MOLD USING SAID CLEANING SHEET | NITTO DENKO CORPORATION (JP) | 1993-06-02 | — | — | EP | disclosed |
| EP-0272685-B1 | MOLD-RELEASING SHEET AND METHOD FOR APPLYING MOLD-RELEASING AGENT ONTO MOLD SURFACE USING SAID SHEET | NITTO DENKO CORPORATION (JP) | 1992-04-29 | — | — | EP | disclosed |
| US-4956132-A | HEATING, CURING AND PRESSING A COATING OF MOLD RELEASING AGENT TO FORM A UNIFORM LAYER | NITTO DENKO CORPORATION (JP) | 1990-09-11 | — | — | US | disclosed |
| US-4935175-A | SEMICONDUCTORS; UNCURED RUBBER AND REMOVAL AID OF IMIDAZOLES AND IMIDAZOLINES; CURING | NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1990-06-19 | — | — | US | disclosed |
| EP-0272685-A2 | Mold-releasing sheet and method for applying mold-releasing agent onto mold surface using said sheet | NITTO DENKO CORPORATION (JP) | 1988-06-29 | — | — | EP | disclosed |
| EP-0271107-A2 | Mold cleaning composition, sheet for cleaning mold, and method for cleaning mold using said cleaning sheet | NITTO DENKO CORPORATION (JP) | 1988-06-15 | — | — | EP | disclosed |