Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2737384 | 0.78 | — | — | |
| SCHEMBL7064687 | 0.77 | — | — | |
| SCHEMBL2898646 | 0.72 | POLB (0.41) | ALDH1A1 | |
| Benzene SCHEMBL28157385 | 0.69 | CYP1A2 (0.48) | ALDH1A1 | |
| SCHEMBL17187518 | 0.65 | USP2 (0.30) | — | |
| SCHEMBL11764624 | 0.63 | ALDH1A1 (0.40) | ALDH1A1 | |
| SCHEMBL1973183 | 0.63 | — | — | |
| SCHEMBL9004895 | 0.62 | TSHR (0.30) | — | |
| SCHEMBL3409567 | 0.61 | — | — | |
| SCHEMBL11597630 | 0.61 | TSHR (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0271107-B1 | MOLD CLEANING COMPOSITION, SHEET FOR CLEANING MOLD, AND METHOD FOR CLEANING MOLD USING SAID CLEANING SHEET | NITTO DENKO CORPORATION (JP) | 1993-06-02 | — | — | EP | claimed |
| US-4935175-A | SEMICONDUCTORS; UNCURED RUBBER AND REMOVAL AID OF IMIDAZOLES AND IMIDAZOLINES; CURING | NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1990-06-19 | — | — | US | claimed |
| US-12011787-B2 | Flux, solder paste, and electronic circuit board | HARIMA CHEMICALS, INCORPORATED (JP) | 2024-06-18 | — | — | US | disclosed |
| US-20220193834-A1 | FLUX, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD | HARIMA CHEMICALS, INCORPORATED (JP) | 2022-06-23 | — | — | US | disclosed |
| EP-3954796-A1 | FLUX, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD | Harima Chemicals, Incorporated (JP) | 2022-02-16 | — | — | EP | disclosed |
| EP-1813406-B1 | Sheet for regenerating a mold | NITTO DENKO CORP (JP) | 2011-06-22 | — | — | EP | disclosed |
| EP-1813406-A1 | Sheet for regenerating a mold | NITTO DENKO CORPORATION (JP) | 2007-08-01 | — | — | EP | disclosed |
| EP-0847843-B1 | Cleaning composition for mold for molding semiconductor device and method of cleaning mold using the same | NITTO DENKO CORP (JP) | 2001-11-21 | — | — | EP | disclosed |
| US-6077360-A | COMPRISING AN UNVULCANIZED RUBBER, A CLEANING AGENT, AND WATER | NITTO DENKO CORPORATION (JP) | 2000-06-20 | — | — | US | disclosed |
| US-5925605-A | CLEANING AND MOLDING FOR SEMICONDUCTORS USING UNVULCANIZED RUBBER | NITTO DENKO CORPORATION (JP) | 1999-07-20 | — | — | US | disclosed |
| EP-0847843-A1 | Cleaning composition for mold for molding semiconductor device and method of cleaning mold using the same | NITTO DENKO CORPORATION (JP) | 1998-06-17 | — | — | EP | disclosed |
| EP-0271107-B1 | MOLD CLEANING COMPOSITION, SHEET FOR CLEANING MOLD, AND METHOD FOR CLEANING MOLD USING SAID CLEANING SHEET | NITTO DENKO CORPORATION (JP) | 1993-06-02 | — | — | EP | disclosed |
| EP-0272685-B1 | MOLD-RELEASING SHEET AND METHOD FOR APPLYING MOLD-RELEASING AGENT ONTO MOLD SURFACE USING SAID SHEET | NITTO DENKO CORPORATION (JP) | 1992-04-29 | — | — | EP | disclosed |
| US-4956132-A | HEATING, CURING AND PRESSING A COATING OF MOLD RELEASING AGENT TO FORM A UNIFORM LAYER | NITTO DENKO CORPORATION (JP) | 1990-09-11 | — | — | US | disclosed |
| US-4935175-A | SEMICONDUCTORS; UNCURED RUBBER AND REMOVAL AID OF IMIDAZOLES AND IMIDAZOLINES; CURING | NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1990-06-19 | — | — | US | disclosed |
| EP-0272685-A2 | Mold-releasing sheet and method for applying mold-releasing agent onto mold surface using said sheet | NITTO DENKO CORPORATION (JP) | 1988-06-29 | — | — | EP | disclosed |
| EP-0271107-A2 | Mold cleaning composition, sheet for cleaning mold, and method for cleaning mold using said cleaning sheet | NITTO DENKO CORPORATION (JP) | 1988-06-15 | — | — | EP | disclosed |